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LED encapsulation piece

A technology of LED packages and LED chips, which is applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of uneven distribution of phosphor powder, inconsistent light pattern, color and color difference, etc., to achieve uniformity improvement, consumption saving, Guaranteed consistent effect

Inactive Publication Date: 2012-07-04
江苏丰庆源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The defect of this kind of LED package is: due to the uneven distribution of phosphor powder in the powder paste, there will be color chromatic aberration, yellow spots, and inconsistent light patterns when it is actually applied to lamps.

Method used

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  • LED encapsulation piece
  • LED encapsulation piece
  • LED encapsulation piece

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] see figure 2 , an LED package, comprising: a bracket 1, an LED chip 2 and several gold wires 3, a reflective cup 10 is formed above the bracket 1, the reflective cup 10 has a flat bottom 11, and the LED chip 2 Installed on the bottom 11, one end of the gold wire 3 is welded to the bottom 11 of the reflective cup 10, the other end of the gold wire 3 is welded to the LED chip 2, and phosphor powder is arranged in the reflective cup 10 A layer 12 and a colloid layer 13 located above the phosphor layer 12, the phosphor layer 12 covers the LED chip 2 and the bottom 11 of the reflective cup. The phosphor layer covering the LED chip 2 is higher than the phosphor layer covering the bottom 11 of the reflective cup. Therefore, the amount of fluorescent powder used is saved, and the manufacturing cost is reduced.

[0013] The present invention replaces the powder slurry in the prior art by setting the fluorescent powder layer 12 and the colloid layer 13, thereby improving the u...

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PUM

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Abstract

The invention discloses an LED encapsulation piece which comprises a bracket, an LED chip and a plurality of gold wires, wherein a reflective cup with a flat bottom is formed above the bracket; the LED chip is mounted at the bottom of the reflective cup; one ends of the gold wires are welded together with the bottom of the reflective cup, and the other ends are welded with the LED chip; a phosphor powder layer is arranged in the reflective cup and a colloidal layer is positioned above the phosphor powder layer; and the phosphor powder layer is coated on the LED chip and the bottom of the reflective cup. The LED encapsulation piece has the advantages of improved evenness of fluorescent powder, and ensures the consistency of the color temperature and the emitting color.

Description

technical field [0001] The invention relates to an LED package. Background technique [0002] LED (Light Emitting Diode), a light-emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. It has the characteristics of small size, low power consumption, long service life, high brightness, environmental protection, and durability. LEDs are packaged as light sources for various products such as display panels, lighting devices, liquid crystal display backlights. see figure 1 , which discloses an LED package in the prior art. The LED package includes: a bracket 1 ′, an LED chip 2 ′, a paste 3 ′, and several gold wires 4 ′. Above the bracket 1 ′ A reflective cup 10 ′ is formed, the reflective cup 10 ′ has a flat bottom 11 ′, the LED chip 2 ′ is mounted on the bottom 11 ′, and one end of the gold wire 4 ′ is connected to the bottom of the reflective cup 10 ′ 11`, the other end of the gold wire 4` is welded to the LED chip 2`, the po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/52
CPCH01L2224/45144H01L2224/48091H01L2224/48227H01L2224/8592H01L2924/00014H01L2924/00
Inventor 朱功波江明季伟源陆鑫豪吴彬
Owner 江苏丰庆源科技有限公司