Method for manufacturing electronic component embedded rigid-flexible PCB

A technology of electronic components and flexible printing, which is applied in the direction of assembling printed circuits with electrical components, printed circuits, and printed circuit manufacturing, etc., which can solve the problems of reduced reliability of printed circuit boards and the accuracy of their functions, increased processing costs, and reduced printed circuit board issues of mass production

Inactive Publication Date: 2012-07-04
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the manufacturing process of electronic component embedded rigid-flex printed circuit boards, many problems arise due to the use of general prepreg (PPG) to fill the peripheral part of electronic components
First, the tooling cost to remove the dummy areas in the flex area required to fabricate a rigid-flex PCB increases due to the increased surface area of ​​the flex area
Secondly, if the dummy area is not completely removed leaving residual material, the reliability of the printed circuit board and the accuracy of its function will be reduced
Finally, the production cycle length due to the manufacture of rigid-flex printed circuit boards will reduce the mass production of printed circuit boards.

Method used

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  • Method for manufacturing electronic component embedded rigid-flexible PCB
  • Method for manufacturing electronic component embedded rigid-flexible PCB
  • Method for manufacturing electronic component embedded rigid-flexible PCB

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Embodiment Construction

[0017] Various features and advantages of the present invention will be more apparent through the following description of embodiments with reference to the accompanying drawings.

[0018] The terms and words used in this specification and claims should not be construed to be limited to their typical meanings or dictionary definitions, but to best describe the implementation known to him / her based on the inventor's ability to properly define the terms. The rule of the best method of the present invention is interpreted as having a meaning or concept related to the technical field of the present invention.

[0019] The above and other objects, features and advantages of the present invention will be more clearly understood through the following detailed description in conjunction with the accompanying drawings. In the specification, reference numerals are added to components throughout the drawings, and it should be noted that the same reference numerals designate the same comp...

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Abstract

The present invention aims at providing a method for manufacturing an electronic component embedded rigid-flexible PCB, wherein in a manufacturing process of the rigid-flexible PCB, a virtual region having a cavity is formed in a flexible region, in order to simplify removing of the virtual region in the flexible region, thereby raising reliability and output of the PCB.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2010-0131006, filed with the Korean Intellectual Property Office on December 20, 2010, entitled "Manufacturing Method of Electronic Components Embedded the Rigid-Flexible Substrate," which is hereby incorporated by reference in its entirety included in this application. technical field [0003] The invention relates to a method for manufacturing an electronic component embedded rigid-flexible printed circuit board. Background technique [0004] Recently, due to an increase in the degree of integration of semiconductor devices, the number of connection terminals (pads) arranged in the semiconductor device to connect the semiconductor device with an external circuit increases, and the arrangement density thereof also tends to increase. For example, if the smallest processed size of a semiconductor device made of silicon or the like is about 0.2 μm, ...

Claims

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Application Information

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IPC IPC(8): H05K3/30
CPCH05K1/185H05K3/4691H05K3/4697
Inventor 边大亭金正守郑栗教金英柱
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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