Stacked Chip Packaging Structure, Synchronous Rectifying Module And Converter Module

Abstract

The present invention discloses a stacked chip packaging structure, a synchronous rectifying module and a converter module. The stacked chip packaging structure comprises the following components: a lead wire frame which comprises a plurality of pins; a first chip which is provided with a first surface and a second surface that opposes the first surface, wherein the first chip comprises a plurality of solder projections which are provided on the first surface, and the first chip is electrically coupled with the lead wire frame through the plurality of solder projections; and a second chip which is provided with a first surface and a second surface that opposes the first surface, wherein the second chip is electrically coupled with the lead wire frame through a plurality of bonding wires, and furthermore the second surface of the second chip adheres on the first surface of the first chip. According to the stacked chip packaging structure, the packaging dimension of the chip can be reduced and energy consumption of the chip can be reduced.

Description

technical field [0001] The present invention generally relates to a semiconductor device packaging structure, in particular to a stacked chip packaging structure, and a synchronous rectification module and a converter module using the stacked chip packaging structure. Background technique [0002] With the rapid growth of demand for miniaturization and portability of portable electronic products in the consumer electronics market in recent years, new requirements are put forward for the packaging structure of integrated circuits. Miniaturized and multi-functional electronic portable products have become the mainstream of the consumer market. The corresponding power supply system is also further developed in the direction of miniaturization, high power, multi-function and high efficiency. The multi-chip packaging structure should be developed in the direction of miniaturization and multi-function. The power discrete chip and the control chip are integrated into the same pack...

AI Technical Summary

Problems solved by technology

However, the bonding wire used for electrical connection of wire-bonded chips is usually very thin and long, and the impedance of the bonding wire is relatively large, and the energy consumption is also relatively large

In addition, if the chips 11 and 12 are not thin enough, it is necessary to press down the chip attaching pad 101 of the lead frame 10 to shorten the length of the bonding wire as much as possible, but this will increase the difficulty of making the lead frame 10

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