LED (light-emitting diode) with improved color rendering index and light emitting efficiency and method for improving color rendering index and light emitting efficiency of LED

Abstract

The invention discloses an LED (light-emitting diode) with improved color rendering index and light emitting efficiency and a method for improving the color rendering index and the light emitting efficiency of the LED. The LED comprises a substrate; the upper surface of the LED is provided with more than one deep groove; the bottom surface of each groove is provided with an LED chip mounting position; the upper surface of the substrate is also provided with a LED chip mounting position; a chip with a wavelength of 380-470nm is arranged in the LED chip mounting position of the groove; a chip with a wavelength of 580-660nm is arranged in the LED chip mounting position of the upper surface of the substrate; fluorescent powder covering the chip with a wavelength of 380-470nm is coated in the groove; and a transparent adhesive layer is coated on the upper surface of the substrate. According to the method, the LED chips with different wave bands are correspondingly arranged in different mounting positions with different height, the LED chip on the topmost layer is not coated by the fluorescent powder, and the LED chips in other mounting positions are coated by the fluorescent powder. Due to the adoption of the structure and the method, the color rendering index and the light emitting efficiency of the LED can be improved at the same time.

Description

technical field [0001] The present invention relates to LEDs and methods. Background technique [0002] Semiconductor lighting fixtures have entered the field of general lighting, and production cost is one of the important factors restricting their development. At present, the commonly used COB packaging of white LEDs is to directly fix multiple blue light chips on the metal-based printed circuit board MCPCB. Although relatively traditional devices Integrated packaging can reduce thermal resistance, and reduce the manufacturing process and cost of the bracket, but the amount of continuous coating of fluorescent glue on the surface is still very large. In addition, the color rendering of the light source is another important factor restricting its development in the field of lighting. In order to improve the color rendering of COB LEDs, such as figure 1 As shown, the method adopted is mainly to add red LEDs to white LEDs, and install the white LEDs and red LEDs on the same...

AI Technical Summary

Problems solved by technology

[0002] Semiconductor lighting fixtures have entered the field of general lighting, and production cost is one of the important factors restricting their development. At present, the commonly used COB packaging of white LEDs is to directly fix multiple blue light chips on the metal-based printed circuit board MCPCB. Although relatively traditional devices Integrated packaging can reduce thermal resistance, while reducing the manufacturing process and cost of the bracket, but the amount of continuous coating of fluorescent glue on the surface is still large

In addition, the color rendering of the light source is another important factor restricting its development in the field of lighting. In order to improve the color rendering of COB LEDs, such as figure 1 As shown, the method adopted is mainly to add red LEDs to white LEDs, and install the white LEDs and red LEDs on the same plane. In the US patent US6577073B2 and the application number is 200710008637.5, the application date is 2007.2.16 and the publication date is 2008.8 Such a COB LED structure is disclosed in the Chinese patent documents of .20. This structure and method of packaging the blue chip and the red chip on the same surface of the substrate, the red chip is covered by fluorescent glue, will reduce the red chip. The luminous efficiency of the LED light source affects the overall luminous efficiency of the LED light source.

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