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Combination type three-dimensional light-emitting diode (LED) radiator

A LED heat sink, three-dimensional technology, applied in semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices of lighting devices, etc., can solve problems such as heat conduction of difficult LED chips, and reduce junction temperature , high heat dissipation efficiency, and the effect of prolonging life

Inactive Publication Date: 2012-07-18
SHAANXI TANGHUA ENERGY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, it is more difficult to conduct the heat of the LED chip through the heat sink more effectively.

Method used

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  • Combination type three-dimensional light-emitting diode (LED) radiator
  • Combination type three-dimensional light-emitting diode (LED) radiator

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Experimental program
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Embodiment Construction

[0021] The present invention will be described in detail below in combination with specific embodiments.

[0022] A combined three-dimensional LED heat sink according to the present invention is provided with two layers of thin-plate-shaped heat sinks, and a thin-plate heat-conducting sheet 4 is sandwiched between the two thin-plate heat sinks; The fin-shaped protrusions of the array, the thin plate and the fin-shaped protrusions form a fin-shaped heat sink 1; the two ends of the thin plate of the lower heat sink are provided with folded sheets, and the folded sheets are provided with bulging curved surfaces, and the thin plate, the folded sheets and the The curved surface on the folded sheet forms the wing-shaped heat sink 3 ; the integrated LED chip 5 is embedded in the thin plate of the wing-shaped heat sink 3 . The cross-section of the fin-shaped protrusion on the fin-shaped heat sink 1 is rectangular or triangular. Strip grooves are arranged on the folded-up sheet and th...

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Abstract

The invention relates to a combination type three-dimensional light-emitting diode (LED) radiator. Radiator structures used by traditional high-power LED lamps all adopt a mode that chips are installed under radiators, and effective radiating basically relies on superficial areas of the radiators. The combination type three-dimensional LED radiator is provided with two laminal radiating fins, and a laminal heat-conducting fin is clamped between the two laminal radiating fins. The upper surface of the upper-layer laminal radiating fin is provided with a fin-shaped protrusion. Turning-up pieces are arranged at two ends of the lower-layer laminal radiating fin and provided with plump curved surfaces. Integrated LED chips are embedded into wing-shaped laminal radiating fins. The section of the fin-shaped protrusion is rectangular or triangular. The turning-up pieces and the curved surfaces are both provided with strip-shaped slots. The combination type three-dimensional LED radiator adopts a three-dimensional radiating fin structure, increases the radiating areas of the LED chips, improves the radiating efficiency through the heat-conducting fin and effectively prolongs the service life of the LED lamps.

Description

technical field [0001] The invention belongs to the technical field of LED lamps, and in particular relates to a combined three-dimensional LED radiator. Background technique [0002] As a new generation of green and environmentally friendly solid-state lighting source, light-emitting diode LED has a series of advantages such as low power consumption, pure light color, all solid state, light weight, small size, and environmental protection. When the LED emits light, part of the energy will be converted into heat, which will increase the temperature of the LED chip. The temperature has a great influence on the working performance of the LED chip. High temperature will lead to the reduction of photons emitted by the chip, the decrease of color temperature quality, the acceleration of chip aging, and the shortening of device life and other serious consequences. Therefore, in order to ensure the normal operation of the LED, the heat emitted by it must be dissipated in time. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/70F21V29/76F21Y115/10
Inventor 胡民浩高辉
Owner SHAANXI TANGHUA ENERGY
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