Thinned image capture module and manufacturing method thereof

An image capture and module technology, which is applied in image communication, radiation control devices, color TV components, etc., can solve problems such as gold wire tearing, displacement, and adhesion difficulties, so as to solve alignment difficulties and prevent interference Effect

Inactive Publication Date: 2012-07-18
陈淑姿
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the materials of the metal plate 931 and the printed circuit board 932 are different, so there is a significant difference in the number of expansions when heated, and there are also difficult

Method used

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  • Thinned image capture module and manufacturing method thereof
  • Thinned image capture module and manufacturing method thereof
  • Thinned image capture module and manufacturing method thereof

Examples

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Embodiment Construction

[0056] Please refer to Fig. 1 to Fig. 13, the structure and manufacturing method of the selected embodiment of the present invention are shown in the figure, which is for illustration only, and is not limited by this embodiment in patent application.

[0057] The present invention provides a thinned image capture module and a manufacturing method thereof. Firstly, the structure of the image capture module of this embodiment is described.

[0058] As shown in Figures 1 to 3, the image capture module of this embodiment includes a printed circuit board 1, a number of electronic components 2, a photosensitive element 3, a light-transmitting glass 4 and a lens 5, wherein: As shown in Figure 3, the printed circuit board 1 has soldering pads 10 on the front surface, the soldering pads 10 mentioned above are connected to the circuit (not shown in the figure) in the printed circuit board 1, and the aforementioned electronic components 2 are correspondingly connected to each other. on t...

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Abstract

The invention relates to a thinned image capture module and a manufacturing method of the thinned image capture module. The structure comprises a printed circuit board which is provided with a plurality of electronic components; a light-sensing component is packaged on the printed circuit board; a lens is arranged on the light-sensing component to capture an image. The manufacturing method comprises the steps of manufacturing the printed circuit board, tapping a hole on the printed circuit board, adhering a metal film, packaging the light-sensing component and packaging an electronic surface. The manufacturing method specifically comprises the following steps of: manufacturing the printed circuit board and then tapping the hole; adhering the metal film at the back side to cover the hole; packaging the light-sensing component; and packaging the plurality of electronic components on the electronic surface. The overall thickness of the whole image capture module is reduced so as to meet the thickness demand of a thin type notebook computer shell, and the light-sensing component can be stably combined to the printed circuit board so as to prevent from breaking a gold wire in electrical connection due to displacement of the light-sensing component.

Description

technical field [0001] The invention relates to an image capture module, in particular to a thinned image capture module and a manufacturing method thereof. Background technique [0002] According to the notebook computers currently on the market, some of them are equipped with an image capture module on the top of the screen to capture images for communication or image recording. In terms of the overall size of notebook computers, the design trend is light, thin and small, and the pixel value of the image capture module is also required to be higher. At present, the thickness of the thinnest notebook computer casing is only 5mm, which can provide 300,000 pixel images. The installation space of the capture module (including the lens) is only 3.5 mm. According to the current assembly method of the image capture module, the overall thickness of the image capture module with more than 300,000 pixels is relatively large, and the image capture with a larger pixel value Assemblin...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L27/146H01L21/50H04N5/225G02B7/02G03B30/00
CPCH01L2224/48091H01L2224/45144H01L2924/3025H01L2924/00014H01L2924/00
Inventor 陈淑姿
Owner 陈淑姿
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