Unlock instant, AI-driven research and patent intelligence for your innovation.

LED (light emitting diode) packaging method, LED packaging structure and display screen

A technology of LED packaging and packaging method, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of poor product reliability, dead lights, and SMD LEDs cannot break through waterproof, moisture-proof and ultraviolet rays, and improve the ability of waterproof and moisture-proof. , the effect of high reliability

Inactive Publication Date: 2012-07-18
深圳市安普光光电科技有限公司
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing technology, SMD LEDs have been unable to break through the outdoor waterproof, moisture-proof and UV-proof packaging technology, so the traditional packaging structure of Lamp is still used in the outdoor display market.
At present, SMD materials adopt PLCC 6 and PLCC 4 structures. Among them, the hygroscopic characteristics of the PPA plastic used in PLCC lead to poor waterproof and moisture-proof effects of the product. LEDs used in outdoor displays often have bad phenomena such as dead lights, and the products are reliable. poor sex

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED (light emitting diode) packaging method, LED packaging structure and display screen
  • LED (light emitting diode) packaging method, LED packaging structure and display screen
  • LED (light emitting diode) packaging method, LED packaging structure and display screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] like Figure 1 to Figure 5 As shown, the LED packaging method provided by the embodiment of the present invention can be used in the packaging of SMD LEDs. The above-mentioned packaging method includes the following steps: setting the lead frame 100 made of metal material, and then setting the upper package case 210 and the lower package case 220 respectively on the upper and lower sides of the lead frame 100, and the upper package case 210 and the lower package case 220 The position of corresponds to the same area on the lead frame 100 . The upper package case 210 and the lower package ca...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention is suitable for the technical field of LEDs (light emitting diode) and discloses an LED packaging method, an LED packaging structure and a display screen. The packaging method comprises the steps of arranging a lead frame, respectively arranging an upper packaging shell and a lower packaging shell on the upper surface and the lower surface of the lead frame, filling lower packaging glue in the lower packaging shell, placing an LED chip in the upper packaging shell, connecting the LED chip on the lead frame, and filling upper packaging glue in the upper packaging shell. The packaging structure comprises the lead frame and the LED chip, wherein the upper side and the lower side of the lead frame are respectively provided with the upper packaging shell and the lower packaging shell, the LED chip is arranged in the upper packaging shell and is fixedly connected on the lead frame, the upper packaging shell is internally provided with the upper packaging glue which covers on the LED chip, and the lower packaging shell is internally provided with the lower packaging glue. The display screen is provided with the LED packaging structure. According to LED packaging method, the LED packaging structure and the display screen, the LED packaging structure adopts a double-layer packaging design, so that the product performance is high.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a packaging method of a chip type LED, an LED packaging structure and a display screen including the LED packaging structure. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can directly convert electricity into light. It changes the principle of incandescent lamp tungsten filament luminescence and energy-saving lamp three-based toner luminescence, and uses electric field luminescence. The characteristics of LED are very obvious: long life, high luminous efficiency, no radiation and low power consumption. [0003] The spectrum of LED is almost all concentrated in the visible light frequency band. The LED light source can use the principle of red, green and blue three primary colors. Under the control of computer technology, the three colors have 256 gray levels and can be mixed arbitrarily to produce 256×256×256= 1677...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/48H01L33/54H01L25/075
CPCH01L24/97H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/181
Inventor 李星肖文玉
Owner 深圳市安普光光电科技有限公司