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System and method for wafer carrier vibration reduction

A chip carrier and control system technology, applied in semiconductor/solid-state device manufacturing, furnace, charge manipulation, etc., can solve problems such as damage, cross-contamination between wafers and wafers

Inactive Publication Date: 2012-07-18
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This cleaning method can lead to cross-contamination within the wafer and between wafers, as well as damage from insufficient drying or prolonged chemical exposure

Method used

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  • System and method for wafer carrier vibration reduction
  • System and method for wafer carrier vibration reduction
  • System and method for wafer carrier vibration reduction

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Embodiment Construction

[0021] According to one aspect of the present invention, the systems and methods of the present invention provide the ability to detect carrier structure motion by detecting vibrations associated with the carrier structure in a wet chemical cleaning system, and to reduce Capability of undesired movement of the carrier structure.

[0022] Specifically, according to one aspect of the invention, the system includes a vibration sensor portion in addition to the wafer carrier position controller. The vibration sensor section can detect vibration of the wafer carrier structure and can output a vibration signal according to the detected vibration. The wafer carrier position controller may then instruct the drive section to modify the motion of the wafer carrier structure based on the vibration signal to reduce the detected vibration. In this way, movement of the wafers within the wafer carrier structure during cleaning can be significantly reduced.

[0023] Now refer to the attache...

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PUM

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Abstract

An aspect of the present invention provides a system and method for controlling a wafer cleaning system having a wafer carrier and a driving portion. The wafer carrier can move along a path in a first direction and a second direction. The driving portion can controllably move the wafer carrier in the first direction and the second direction. The control system includes a vibration sensor portion and a wafer carrier position controller. The vibration sensor portion can detect vibration of the wafer carrier and can output a vibration signal based on the detected vibration. The wafer carrier position controller can instruct the driving portion to modify motion of the wafer carrier based on the vibration signal to reduce the detected vibration.

Description

technical field [0001] This application claims priority to US Provisional Application No. 61 / 254,536, filed October 23, 2009, which is hereby incorporated by reference in its entirety. Background technique [0002] In semiconductor chip fabrication, plasma etch methods are known to leave undesirable residues and particles. These residues and particles, if left on the wafer, can become defects that lead to electrical failure and device failure. When chemical cleaning methods are used to remove these particles and residues, equipment yields are increased and failures are reduced. However, this must be done carefully so that the chemical cleaning method is effective in removing residues and particles without causing any damage to the wafer. Therefore, the chemical cleaning method must be precisely detected and fully optimized so that the wafer cleaning is as efficient as possible without causing damage in any way. [0003] Conventional cleaning methods generally involve plac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677B65G49/07H01L21/673H01L21/304
CPCH01L21/67028H01L21/67259H01L21/67253H01L21/67739
Inventor 约翰·瓦尔库瓦列里·李维克克里斯汀·西斯特斯基
Owner LAM RES CORP