Front open type wafer box provided with inflatable support element module

Abstract

The invention provides a front open type wafer box. An inflatable support element module is arranged at a position of the side wall of the front open type wafer box adjacent to the back wall and is provided with a buffer air chamber, in addition, an air inlet is arranged at one end of the buffer air chamber, the air inlet is connected with an air valve arranged at the bottom surface of the buffer air chamber, an air outlet passage is arranged in a direction of the inflatable support element module facing an opening of the front open type wafer box, in addition, a long seam is arranged at one end of the air outlet passage, in addition, a porous material is arranged in the long seam, an air flow passage is arranged between the air outlet passage and the buffer air chamber so that the air outlet passage and the buffer air chamber can be mutually communicated, and in addition, a plurality of support ribs which are in arrangement vertical to the long seam at intervals are arranged on one side edge of the long seam.

Description

technical field [0001] The present invention relates to a front-loading wafer cassette, and more particularly, to a front-loading wafer cassette in which an inflatable support module is disposed and a buffer is disposed in the inflatable support module. The air chamber allows the gas to form a uniform gas flow field in the front opening wafer cassette. Background technique [0002] In the semiconductor manufacturing process, since semiconductor wafers need to go through various manufacturing processes and manufacturing process equipment, they are transported to different manufacturing process workstations through an automated system. In order to facilitate the handling of the wafers and prevent the wafers from being polluted by the outside world, a sealed container is often used for automatic equipment delivery. Please refer to figure 1 Shown is the schematic diagram of the wafer box of known technology. This wafer box is a front opening type wafer box (Front Opening Unif...

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a front-opening wafer box equipped with an inflatable support module, so as to overcome the insufficient wafer support force and excessive contact area caused by the inflatable support module inside the box body of the known wafer box. And easy to produce particles and other problems

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