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Liquid treatment device and liquid treatment method

A technology of liquid treatment and liquid treatment, which is applied in the field of liquid treatment devices, can solve the problems of liquid medicine residue, liquid medicine scattering, wafer W fouling, etc., and achieve the effect of preventing substrate fouling

Active Publication Date: 2015-12-09
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] exist Figure 9 and Figure 10 In the conventional liquid processing apparatus 200 as shown, when the wafer W is liquid-processed in the processing chamber 210 , the chemical liquid and the like are scattered, and the chemical liquid and the like may adhere and remain on the cup 230 in the processing chamber 210 . upper part of
In this case, adverse effects such as contamination of the wafer W due to the atmosphere of the remaining chemical solution may occur in the subsequent wafer W processing.

Method used

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  • Liquid treatment device and liquid treatment method
  • Liquid treatment device and liquid treatment method
  • Liquid treatment device and liquid treatment method

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no. 1 Embodiment approach

[0036] Next, a first embodiment of the present invention will be described with reference to the drawings. Figure 1 to Figure 8 It is a figure which shows the liquid processing apparatus of this embodiment. In more detail, figure 1 It is a top view of a liquid treatment system including a liquid treatment device according to an embodiment of the present invention viewed from above. in addition, figure 2 is a plan view showing a schematic configuration of a liquid processing device according to an embodiment of the present invention, image 3 yes means figure 2 A side view of the schematic structure of the liquid treatment device shown. in addition, Figure 4 and Figure 5 yes means figure 2 A vertical cross-sectional view of the detailed structure of the liquid treatment device shown. in addition, Figure 6A (a)~ Figure 6A The (c) means set in Figure 4 An enlarged vertical cross-sectional view of the structure of the holding member of the holding plate in the...

no. 2 Embodiment approach

[0092] Next, use Figure 11 and Figure 12 A second embodiment of the present invention will be described. Figure 11 and Figure 12 The second embodiment shown is only different in the cleaning structure of the drain cup 42 composed of the rotating cup 40 and the drain cup 42, and the other structures are the same as Figure 1 to Figure 8 The first embodiment shown is substantially the same.

[0093] exist Figure 11 and Figure 12 in, right with Figure 1 to Figure 8 Components that are the same as those in the first embodiment shown are assigned the same reference numerals and detailed description thereof will be omitted.

[0094] like Figure 11 As shown, the upper part of the drain cup 42 is formed with a first inclined portion inclined in such a way that the height gradually decreases from the inner peripheral edge 42c to the middle portion 42e in the direction from the inner peripheral edge 42c to the outer peripheral edge 42d. 42a1 and the second inclined porti...

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Abstract

Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contamination attached to a cup. The liquid processing apparatus includes: a processing chamber in which a substrate holding unit holding a substrate and a cup placed around the substrate holding unit are installed; a nozzle for supplying a processing liquid to the substrate held by the substrate holding unit; and a cup cleaning unit cleaning the cup by supplying a cleaning liquid to the upper part of the cup. A concave portion is formed in the upper part of the cup and the cup cleaning units supply the cleaning liquid to the concave portion in the upper part of the cup.

Description

technical field [0001] The present invention relates to a liquid processing device and a liquid processing method for performing liquid processing such as cleaning, etching, plating, and development on a substrate by supplying a processing liquid to the substrate while rotating the substrate in a horizontal state. Background technique [0002] Heretofore, substrates such as semiconductor wafers (hereinafter also referred to as wafers) are rotated while maintaining them in a horizontal state, and a processing solution is supplied to the front and back surfaces of the substrates to perform cleaning, etching, and plating on the substrates. Various types of liquid processing apparatuses for liquid processing such as processing and development processing are known (for example, refer to Patent Document 1, etc.). Patent Document 1 discloses a sheet-type liquid processing apparatus that processes substrates one by one, in which a substrate is held horizontally by a spin chuck and r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/68742H01L21/67017H01L21/67051H01L21/6719H01L21/68728Y10S134/902
Inventor 香川興司溝田昌吾东岛治郎
Owner TOKYO ELECTRON LTD