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Air tension apparatus

A technology of air tension device and supply device, which is applied in the direction of electrical components, non-electric welding equipment, circuits, etc., to achieve the effect of large tension

Inactive Publication Date: 2012-08-08
АДАМАНТ НАМИКИ ПРЕСИЖН ДЖУЭЛ КО ЛТД
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, during the bonding operation, the metal wires 106 are loosened, and the adjacent metal wires bonded between the semiconductor chip 111 and the wire 112 come into contact with each other, and a short circuit may occur.

Method used

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Examples

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Embodiment 1

[0060] Hereinafter, the present invention will be described in detail using specific examples, but the present invention is not limited to the examples.

[0061] exist figure 1In the device shown, two types of upper insertion tube bodies with inner diameters (φA) of 0.300 mm and 0.400 mm in the first insertion hole are used, and inner diameters (φB) of the fine hole are 0.080 mm, 0.090 mm, and 0.100 mm. , 0.110mm, 0.120mm and 0.130mm six types of lower through-pipe body. At this time, the ratio (φA / φB) of the inner diameter of the first insertion hole to the inner diameter of the fine hole is 3.75, 3.33, 3.00, 3.00, 2.73, 2.50, and 2.31; when the inner diameter (φA) of the first insertion hole is 0.400 mm, they are 5.00, 4.44, 4.00, 3.64, 3.33, and 3.08, respectively. In addition, the upper insertion tube whose overall length (L1) of the upper insertion tube body is 30.0 mm, and the lower insertion tube whose overall length (L2) of the pore part of the lower insertion tube ...

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Abstract

Disclosed is an air tension device, comprising a through tube (4), further comprising a through aperture (3), wherethrough a metallic wire-bonding wire (2) is capable of passing; a support body (6) whereupon the through tube (4) is inserted, and which thereby supports the through tube (4); and a pressurized gas supply apparatus (7), which supplies pressurized gas to the through aperture (3) via a gas channel (18) that is disposed upon the through tube (4). The through aperture (3) is formed from a first through aperture (10), and a second through aperture (11), which is positioned below the first through aperture (10) and further comprises a narrow aperture portion (17) that has a smaller diameter than first through aperture (10). The diameter of the narrow aperture portion (17) is 0.070-0.100mm, and is formed such that the ratio of the diameter of the first through aperture (10) to the diameter of the narrow aperture portion (17) is greater than or equal to 3.00 and less than 6.00. The apparatus thus avoids damaging the metallic wire (2) and applies a prescribed appropriate tension thereupon.

Description

technical field [0001] The present invention relates to an air tension device used in a wire bonding device for connecting semiconductor chips. Background technique [0002] Conventionally, a wire bonding apparatus is known as an apparatus for mounting a semiconductor chip on a circuit board and connecting terminals of the semiconductor chip to pins on the circuit board with metal wires. Such as Figure 3A to Figure 3C As shown, the wire bonding device 101 is composed of an air tension device 102 , a holder 103 and a capillary 104 . The metal wire 106 is wound on a reel not shown in the figure, and the front end of the metal wire 106 pulled out from the reel is inserted into the not shown in the figure formed on the above-mentioned air tension device 102, the holder 103 and the capillary 104. inserted into the through hole so that it is located at the front end portion of the capillary 104 . [0003] The holder 103 and the capillary 104 are configured to move in conjunctio...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L2224/851H01L24/85H01L2224/78631B23K20/005H01L2924/01005H01L24/78B23K2201/42H01L2924/01082B23K20/26H01L2224/45144H01L2924/01013H01L2224/85181H01L2224/786H01L2224/48091H01L2924/01029H01L2224/48464H01L2924/01004H01L2224/78301H01L2224/48227H01L2924/01033B23K2201/40H01L2924/01079B23K2101/40B23K2101/42H01L24/48H01L2224/05599H01L2224/45015H01L2224/45124H01L2224/45147H01L2224/78621H01L2224/85399H01L2924/00014H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/00
Inventor 沟口英孝齐藤利男照井广己
Owner АДАМАНТ НАМИКИ ПРЕСИЖН ДЖУЭЛ КО ЛТД
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