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Detection method for detecting substrate damage in placing box and placing box

A detection method and a technology for placing boxes, which are applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems that affect the yield of array substrates, limited detection capabilities, and ineffective detection of damaged substrates, etc. , to achieve the effect of avoiding continuous damage, reducing inspection costs and ensuring yield

Inactive Publication Date: 2014-08-06
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the substrate is placed in a storage box for transportation, and the entire transportation process is fully automated. When a problem occurs in the process equipment and the substrate is damaged, some equipment has limited detection capabilities or no substrate damage detection device at all. The substrate cannot be detected effectively, so it will seriously affect the yield of the array substrate in the subsequent production process

Method used

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  • Detection method for detecting substrate damage in placing box and placing box
  • Detection method for detecting substrate damage in placing box and placing box
  • Detection method for detecting substrate damage in placing box and placing box

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] The placement box 10 provided by the embodiment of the present invention, such as figure 1 , figure 2 shown, including:

[0020] Place the box frame 102, the top metal plate 101 at the top of the box frame 102, the bottom metal plate 103 at the bottom of the box frame 102, the box frame 102 is provided with a multi-layer substrate placement frame 104, and also includes:

[0021] At least one pressure sensor 105 is provided on the substrate placing fr...

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PUM

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Abstract

The embodiment of the invention provides a detection method for detecting substrate damage in a placing box and the placing box, and relates to the field of liquid crystal panel manufacture. The detection method can detect if substrates are damaged in the placing box, so that the rate of finished products of the follow-up technique is ensured. The placing box comprises a placing box frame, a top metal plate positioned on the top of the placing box, and a bottom metal plate positioned at the bottom of the placing box frame, wherein multiple layers of substrate placing frames are arranged on the placing box frame, and at least one pressure sensor is arranged on each layer of substrate placing frame of the placing box, or at least one pressure sensor is arranged on every other of the substrate placing frame of the placing box; the pressure sensors are used for acquiring the pressure values of the substrates placed on the substrate placing frame; a data processing unit is connected with the pressure sensors on the substrate placing frames respectively and is used for determining that whether the substrates placed on the substrate placing frames are damaged or not according to the pressure values acquired by the pressure sensors. The embodiment of the invention is used for detecting the substrates in the substrate transporting process.

Description

technical field [0001] The invention relates to the field of liquid crystal panel manufacture, in particular to a method for detecting damage to a substrate in a placement box and the placement box. Background technique [0002] In the process of TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Field Effect Transistor Liquid Crystal Display) array process, usually the substrate needs at least 4 times of film formation, photolithography, etching, stripping and other processing processes. In the process, the substrate needs to be transported back and forth between the equipment. Generally, the substrate is placed in a storage box for transportation, and the entire transportation process is fully automated. When a problem occurs in the process equipment and the substrate is damaged, some equipment has limited detection capabilities or no substrate damage detection device at all. The substrate cannot be detected effectively, so the yield of the array substrate wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/66
Inventor 董云秦纬
Owner BOE TECH GRP CO LTD
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