Detection method for detecting substrate damage in placing box and placing box
A detection method and a technology for placing boxes, which are applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems that affect the yield of array substrates, limited detection capabilities, and ineffective detection of damaged substrates, etc. , to achieve the effect of avoiding continuous damage, reducing inspection costs and ensuring yield
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] The placement box 10 provided by the embodiment of the present invention, such as figure 1 , figure 2 shown, including:
[0020] Place the box frame 102, the top metal plate 101 at the top of the box frame 102, the bottom metal plate 103 at the bottom of the box frame 102, the box frame 102 is provided with a multi-layer substrate placement frame 104, and also includes:
[0021] At least one pressure sensor 105 is provided on the substrate placing fr...
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