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Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer

A polyimide glue, axial diode technology, applied in the direction of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc. High production efficiency, reasonable method, and the effect of improving the pass rate

Active Publication Date: 2014-09-17
常州银河电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will also affect the electrical properties of the workpiece, resulting in low product yield and low production efficiency.

Method used

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  • Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer
  • Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer
  • Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer

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Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0028] like figure 1 As shown, an axial diode includes a diode chip 1, a first copper electrode 2, a second copper electrode 3, a protective glue layer 4 and an epoxy insulating glue 6; the diode chip 1 is located between the first copper electrode 2 and the second copper electrode Between the two copper electrodes 3, and the positive and negative contact surfaces of the diode chip 1 are welded and connected to the first copper electrode 2 and the second copper electrode 3 respectively through the first soldering adhesive layer 5 and the second soldering adhesive layer 5' respectively. ; The first copper electrode 2 has a first lead 2-1 integrated with it, and the second copper electrode 3 has a second lead 3-1 integrated with it; and it: the first copper electrode 2 has a The first boss 2-2, the second copper electrode 3 has a second boss 3-2, the diode chip 1 is located between the first boss 2-2 and the second boss 3-2; the protective glue layer 4 Coated on the diode chip...

specific Embodiment approach 2

[0030] like figure 2 As shown, a method for preparing an axial diode whose protective adhesive layer is polyimide glue, the preparation method includes mounting, welding, pickling, gluing, curing, molding, aging and electroplating, and it:

[0031] a. The mounting step is to pack the first copper electrode 2, the first welding adhesion layer 5, the diode chip 1, the second welding adhesion layer 5' and the second copper electrode 3 into the graphite boat in sequence, and make it close together;

[0032] b. The welding step is to put the graphite boat into the welding furnace for structural welding, the time is within 6-10 minutes, and the temperature is controlled within the range of 300-360°C;

[0033]c, the pickling step is to put the workpiece after the welding step into the through hole of the pickling plate, then inject the mixed pickling solution into the working concave surface of the pickling plate to corrode the periphery of the diode chip 1, and the time is control...

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PUM

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Abstract

The invention discloses an axial diode, which includes a diode chip, first and second copper electrodes, a protective glue layer and epoxy insulating glue; the diode chip is located between the two two copper electrodes, and the positive and negative poles of the diode chip The contact surfaces are respectively welded and connected to the corresponding copper electrodes as a whole through the first and second welding adhesive layers; the two copper electrodes respectively have lead wires integrated with each other; and among them: the first and second copper electrodes respectively have bosses, diode The chip is located between the two two bosses; the protective glue layer is coated on the periphery of the diode chip, the two bosses, and the two soldering adhesive layers; the epoxy insulating glue is coated on the two copper electrodes, the protective glue layer, and Part out the perimeter of the two second leads. The method for preparing the protective adhesive layer as polyimide adhesive includes mounting, welding, pickling, gluing, curing, molding, aging and electroplating. The axial diode of the invention has good electric performance, high reliability, more reasonable preparation method, high production efficiency and the like.

Description

technical field [0001] The invention relates to an axial diode and a preparation method thereof, belonging to the technical field of electronic semiconductor devices. Background technique [0002] At present, the existing axial diode is installed on the electronic circuit board through its lead wire, and plays a role of rectification. The protective glue included in the axial diode of this structure is silicon rubber. However, the silicone rubber is coated on the outer periphery of the diode chip, the first copper electrode, the second copper electrode, the first welding adhesive layer and the second welding adhesive layer, which can only play a role of sealing protection (as attached image 3 shown), but cannot absorb various ions remaining on the surface of the diode chip included in the workpiece after pickling during its preparation process. Detect the electrical properties of the workpiece in the range of 85~90%, and have a great influence on the electrical properties ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/861H01L23/29H01L23/49H01L21/56
CPCH01L24/33H01L24/01H01L2224/01H01L2924/181H01L2924/00012
Inventor 朱伟英莫行晨
Owner 常州银河电器有限公司