Infrared sensor

Abstract

The present invention provides an infrared sensor capable of obtaining a high temperature difference between thermal sensors for infrared detection and temperature compensation, capable of miniaturization, and having an inexpensive structure. The infrared sensor of the present invention comprises an insulating film (2), a first thermosensitive element (3A) and a second thermosensitive element (3B) which are spaced apart from each other on one side of the insulating film (2), formed on an insulating One side of the film (2) is bonded with a pair of bonding electrodes (4) of the first thermosensitive element (3A) and the second thermosensitive element (3B) respectively, facing the first thermosensitive element (3A) and An infrared absorbing film (5) disposed on the other side of the insulating film (2), and an infrared reflecting film (6) opposite to the second thermal element (3B) and disposed on the other side of the insulating film (2) , the first thermistor element (3A) and the second thermistor element (3B) have a plate-shaped thermistor element body (3a) and are respectively formed on the surface and back surface of the thermistor element body (3a) and one of them is glued A pair of electrode layers bonded to the bonding electrode (4).

Description

technical field [0001] The present invention relates to an infrared sensor that detects infrared rays from a measurement object to measure the temperature and the like of the measurement object. Background technique [0002] Conventionally, an infrared sensor has been used as a temperature sensor for measuring the temperature of an object to be measured by non-contact detecting infrared rays radiated from the object to be measured. [0003] For example, Patent Document 1 proposes an infrared sensor including a resin film provided on a holder, an infrared detection thermal element provided on the resin film and detecting infrared rays through a light guide portion of the holder, and an infrared sensor provided in a light-shielding state. A thermal sensor for temperature compensation that detects the temperature of the holder on a resin film. In this infrared sensor, an infrared absorbing film is formed on the inner surface of the light guide, and an infrared absorbing materi...

AI Technical Summary

Problems solved by technology

[0008] That is, in the infrared sensors of Patent Documents 1 and 2, a resin film containing an infrared absorbing material such as carbon black is used to shield one thermal sensor side from light for the purpose of temperature compensation. Due to the high thermal conductivity, it is difficult to generate a large temperature difference between the thermal sensor for infrared detection and temperature compensation.

Also, in order to increase the temperature difference between these heat-sensitive elements, it is necessary to increase the distance between the heat-sensitive elements, resulting in a large overall shape, and there is a problem that miniaturization is difficult

In addition, it is necessary to provide a structure for shielding the thermal sensor for temperature compensation on the case itself, so the price becomes high.

[0009] In addition, in Patent Document 2, since a housing with good heat conduction is used, the heat from the infrared absorbing film is also dissipated to cause a disadvantage in that the sensitivity deteriorates.

Also, since it is a loose-leaf type with lead wires connected, thermal space conduction occurs in the narrow space between the thermistor and lead wires.

In addition, in the case of loose leaf type or chip type thermistors, there is a disadvantage that a large measurement error occurs when a temperature gradient occurs in the resin film due to spot measurement.

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