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Cyanate/bis (oxazoline)/epoxy/polyethylene glycol modified resin composition

A technology of polyethylene glycol modification and bisoxazoline, which is applied in the field of cyanate ester/bisoxazoline/epoxy/polyethylene glycol modified resin composition, and can solve the problem of bending strength and modulus reduction, The improvement of mechanical properties is small, and the effect of heat resistance loss is small

Inactive Publication Date: 2013-10-30
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, cyanate ester / epoxy modified resin has the disadvantage of small improvement in mechanical properties, such as the ratio of the two monomers (-OCN : epoxy) Although the impact strength of the cured resin has increased, the flexural strength and modulus show a downward trend

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Weigh 30g bisphenol L-type cyanate (BEDCy), 6g 2,2'-(1,3-phenylene)-bisoxazoline in a beaker, 10g o-cresol novolac epoxy, then add 2.5g poly Ethylene glycol 6000 (PEG-6000, with an average molecular weight of 6000), heated to 80°C to melt, stirred evenly, degassed in a vacuum oven at 80°C for 15 minutes, then poured into a glass coated with silicone ester release agent In the mold, the curing process is carried out in an electronic oven. The curing process can be carried out at 150°C / 1h + 180°C / 1h + 200°C / 2h, and the post-curing condition is 240°C / 3h to obtain a dark brown-red solid resin. Glass transition temperature 259.4°C (DMA method), bending strength 141.1MPa, impact strength 13.6KJ / m 2 .

Embodiment 2

[0024] Weigh 40g bisphenol A type cyanate, 5g 2,2'-(1,3-phenylene)-bisoxazoline, 10g E-44 epoxy, 10g polyethylene glycol 8000 (PEG-8000, Average molecular weight is 8000), all the other are the same with embodiment 1. Obtain a brownish-red cured resin with a glass transition temperature of 233.4°C (DMA method), a bending strength of 153.1MPa, and an impact strength of 16.6KJ / m 2 .

Embodiment 3

[0026] Weigh 20g bisphenol A type cyanate, 10g 2,2'-(1,3-phenylene)-bisoxazoline, 20g E-51 epoxy, 5g polyethylene glycol ten thousand (PEG-10000 , average molecular weight is 10000), and all the other are the same with embodiment 1. Obtained a brown-red cured resin with a glass transition temperature of 209.5°C (DMA method), a bending strength of 164.7MPa, and an impact strength of 16.8KJ / m 2 .

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Abstract

The invention relates to a cyanate / bis (oxazoline) / epoxy / polyethylene glycol modified resin composition. The epoxy comprises cyanate monomer, bis (oxazoline) compound, epoxy resin and the polyethylene glycol. The modified resin composition forms polymer with a copolymerization structure through heat curing, and the cured resin is provided with good heat resistance and mechanical property by aid of introduction of long chains of ether bonds of the polyethylene glycol into a crosslinking cured structure.

Description

technical field [0001] The invention relates to a cyanate ester / bisoxazoline / epoxy / polyethylene glycol modified resin composition. Background technique [0002] Cyanate ester / epoxy composition is a type of thermosetting modified resin system that has been studied more. Cyanate ester and epoxy can undergo co-curing reaction during curing to form a heterocyclic polymer. The performance of the cured resin is due to the addition of cyanate ester, the heat resistance, dielectric properties and other properties of the epoxy resin have been improved. At the same time, the two monomers have very good compatibility, can be mixed in any ratio, and are easily soluble in various organic solvents, so the uncured resin has good process performance. This cyanate ester / epoxy modified resin has been popularized and applied in the fields of electronics manufacturing and aerospace. [1. Shimp D A, Haudoc F A, Ising S J. Co-reaction of epoxy and cyanate resins. 33rd Int. Sampe Symposium[C]...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/06C08G59/62C08G59/40
Inventor 李文峰
Owner TONGJI UNIV
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