Isovolumetric cutting speed calculation method for multi-line cutting machine

Abstract

The invention discloses an isovolumetric cutting speed calculation method for a multi-line cutting machine. The isovolumetric cutting speed calculation method for the multi-line cutting machine is realized by solving a feeding speed of any positional point during the multi-line cutting. The feeding speed of any point is obtained according to the formula as follows: F=C*P/[(R<2>-(R-h)<2>)<1/2>*(dw+2*d)*L*K], wherein F is the feeding speed, C is a cutting volume in a unit time, P is a slot pitch of a main roller, R is a radius of a cut material, h is a cutting depth, dw is a diameter of a cutting line, d is a diameter of a cut abrasive material, L is a length of the cut material and K is a safety coefficient. A maximum feeding speed Fmax is set and if the feeding speed F of one positional point, calculated through the formula, is greater than the Fmax, the Fmax is taken as the feeding speed. The isovolumetric cutting speed calculation method for the multi-line cutting machine, disclosed by the invention, has the advantages of guaranteeing the volume amount removed in a unit time as the setting value, adjusting the cutting speed F according to the slot pitch P of the main roller, the cutting position h, the cutting length L, the diameter d of the cut abrasive particle and the like and improving processing efficiency.

Description

technical field [0001] The invention relates to a multi-wire cutting process calculation method. In particular, it relates to a method for improving efficiency by obtaining an optimized feed speed parameter through calculation on the premise that the cutting volume per unit time is assumed to be equal. Background technique [0002] In semiconductor or sapphire processing, multi-wire cutting machines are often used. Multi-wire cutting machine is a new type of cutting equipment with a new concept, referred to as wire saw. Through the high-speed reciprocating motion of the metal wire, the abrasive is brought into the processing area where the bar is cut for grinding, and the hard and brittle materials such as semiconductors are cut into several pieces at a time. Hundreds of thin slices or metal wires are plated with diamond particles for reciprocating cutting. [0003] Multi-wire cutting machine has been widely used in the processing of large-diameter silicon wafers, solar wa...

AI Technical Summary

Problems solved by technology

If the feed speed is adjusted too high, the wire tension will be too high and the wire will be broken, and the bar will be scrapped; if the feed speed is adjusted too low, the cutting efficiency will be reduced, the material will be wasted, and the cost will be increased.