Combined type three-dimensional heat radiation structure fully utilizing heat radiation space for light-emitting diode (LED) and method

A technology for LED lamps and heat dissipation structures, which is applied to semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices for lighting devices, etc. The effect of the total cooling area

Active Publication Date: 2012-10-10
WUXI AIR ELECTRONICS
View PDF9 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of uneven heat dissipation in the prior art, and provide a new combined three-dimensional heat dissipation structure with high heat dissipation efficiency and high space utilization

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Combined type three-dimensional heat radiation structure fully utilizing heat radiation space for light-emitting diode (LED) and method
  • Combined type three-dimensional heat radiation structure fully utilizing heat radiation space for light-emitting diode (LED) and method
  • Combined type three-dimensional heat radiation structure fully utilizing heat radiation space for light-emitting diode (LED) and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] The present invention will be further elaborated below in conjunction with accompanying drawings, and its shape and structure can be realized by those skilled in the art.

[0045] The traditional MR16 LED lamp is composed of an external radiator or an internal radiator (in this example, a cooling cup 17 is selected), a lens 18, an LED display board 19, a lamp interface and a power supply box 20. Figure 4 Connect and install as shown, the heat dissipation part is as follows Figure 5 As shown, fan-shaped heat sinks surround the heat dissipation cup 17 at equal intervals, and the heat dissipation area formed is: (heat dissipation surface 21 + heat dissipation surface 22 + heat dissipation surface 23 + heat dissipation surface 24 + heat dissipation surface 25) * 18 = 6500 square millimeters, traditional heat dissipation Inside the device such as Figure 6 The cavity shown is solid or the power supply is placed, which cannot be used, resulting in uneven heat dissipation o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of manufacturing of light-emitting diode (LED) lamps, in particular to a combined type three-dimensional heat radiation structure fully utilizing heat radiation space for an LED lamp. The combined type three-dimensional heat radiation structure is characterized in that the structure is formed by combining an external heat radiator and an internal heat radiator, wherein the bottom of the internal heat radiator is connected with an LED display panel; the top of the external heat radiator is connected with a lamp joint and a power supply box; a combined type discontinuous multilayered three-dimensional heat radiation structure is arranged on the top of the internal heat radiator and consists of a plurality of heat radiating fins; and a cavity is formed between the adjacent heat radiating fins. The combined type three-dimensional heat radiation structure is adopted at the intensive part of the center heat energy, so that the total area of heat radiation is increased, the effective heat radiation area is maximized, and the defects that the utilization ratio of a heat radiation space is low, the structure of the inner space is airtight and the like can be effectively overcome; and in addition, the heat radiation effect and the output luminance of the combined type three-dimensional heat radiation structure are more than twice those of the traditional LED lamp.

Description

[technical field] [0001] The invention relates to the technical field of manufacturing LED lamps, in particular to a combined three-dimensional heat dissipation structure for LED lamps that fully utilizes the heat dissipation space. [Background technique] [0002] With the increasing popularity of LED lamps, both large-scale outdoor displays and home lighting are inseparable from LED lamps, and LED lamps often affect reliability due to heat dissipation problems, and the brightness cannot meet the requirements of traditional lamps, so they cannot directly replace traditional lamps. Lamps, such as 50W MR16 halogen lamps, can output warm white temperature 2700K 610LM luminous flux, while the same MR16LED lamps can only reach half the brightness of traditional halogen lamps; 150W traditional PAR38 halogen lamps can output warm white temperature 2700K 2000LM luminous flux, LED PAR38 Lamps often do not exceed 1000LM luminous flux output. [0003] Conventional LED lamps, due to pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02
CPCF21V29/26F21V29/00F21K9/1375F21V29/2231F21V29/2268F21V29/2293F21Y2101/02F21K9/23F21V29/71F21V29/773F21V29/78F21V29/83F21Y2115/10
Inventor 顾毅天
Owner WUXI AIR ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products