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Lithography method and device

A lithography equipment and lithography technology, applied in the direction of photoplate making process coating equipment, etc., can solve the problems of large solvent consumption and high production costs, and achieve the effects of reducing production costs, increasing production capacity, and reducing the amount of solvents used

Inactive Publication Date: 2014-05-21
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Since the current process requires that there must be no photoresist around the edge of the glass substrate, the edge of each glass substrate needs to be cleaned several times with solvents to meet the requirements, and the cleaning process requires a large amount of solvent, resulting in higher production costs.

Method used

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  • Lithography method and device

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Embodiment Construction

[0045] The technical solutions of the present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0046] In order to reduce the amount of solvent used in the process of edge removal and reduce production costs, a photolithography method provided by the embodiment of the present invention, such as figure 1 As shown, it mainly includes the following steps:

[0047] Step 101 , performing hydrophobic treatment on the edge position of the surface to be coated with photoresist on the substrate.

[0048] Specifically, the substrate can be hydrophobically treated with a drug solution, the drug solution comprising (C X h Y ) n SiNHSi(C A h B) m or (C X h Y ) n SiNSi(C A h B ) m (C D h F ) s , where the values ​​of subscripts X, A, and D are non-negative integers, the values ​​of subscripts Y, B, and F are positive integers, and the values ​​of subscripts m, n, and s are integers ranging from 1 to 3.

[004...

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Abstract

Embodiments of the disclosed technology disclose a photolithography method and apparatus, and the method comprises: hydrophobicity-treating edge portions of a surface of a substrate to be applied with photoresist; and applying hydrophilic photoresist to the surface of the substrate subject to hydrophobic treatment. With the disclosed technology, the usage amount of thinner in the edge photoresist-removing procedure can be greatly reduced or even eliminated, thereby reducing production costs and increasing production efficiency.

Description

technical field [0001] The invention relates to the field of flat panel display technology, in particular to a photolithography method and equipment. Background technique [0002] With the rapid development of flat panel display technology in recent years, the flat panel display has made great progress in terms of screen size and display quality. With the continuous expansion of the production scale of flat panel display products, the competition among various manufacturers is becoming increasingly fierce. While continuously improving product performance, manufacturers are also making continuous efforts to reduce product production costs in order to improve market competitiveness. [0003] The photolithography process is a very critical process in the manufacturing process of flat panel displays. This process is mainly to coat a surface of a substrate with photoresist. In order to prevent the photoresist coated on the surface of the glass substrate from dripping on the prec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/16
CPCG03F7/16
Inventor 周伟峰薛建设
Owner BOE TECH GRP CO LTD