Panel convey apparatus and panel processing system using apparatus
A substrate transfer and processing device technology, which is applied in the field of substrate transfer devices and substrate processing devices, can solve the problems of uneven completion, poor temperature history records, long transfer time, etc., and achieve the effect of preventing uneven temperature and rapid transfer
Active Publication Date: 2013-12-25
CHUGAI RO CO LTD
View PDF1 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0009] Therefore, there is the following problem: Although the temperature is different between the front end side and the base end side of the robot arm, if the robot arm receives a plurality of glass substrates at the same time, the glass substrate on the front end side is delivered to the part of the robot arm with a higher temperature, and the base end side The glass substrates are delivered to the cold part of the robot arm, so there will be a difference in temperature history in these glass substrates on the front and base sides, resulting in uneven finish
[0010] In addition, in this case, if the glass substrate is delivered after the temperature of the entire robot arm converges to a certain temperature, there is a problem that it takes a long time to transfer.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] Hereinafter, preferred embodiments of a substrate transfer device and a substrate processing device including the substrate transfer device according to the present invention will be described in detail with reference to the drawings. Figure 1 ~ Figure 3 A substrate transfer device according to the first embodiment and a substrate processing device including the substrate transfer device are shown.
[0026] figure 1 It is a schematic diagram showing the configuration of a production line 2 of a substrate processing device that processes a thin glass substrate 1 provided with the substrate transfer device according to the first embodiment, figure 2 It is an explanatory diagram explaining the arrangement of two glass substrates 1a, 1b delivered to the robot arm 3 equipped in the glass substrate transfer device according to the first embodiment, image 3 It is explanatory drawing explaining the procedure which the robot arm 3 equipped in the glass substrate conveyance a...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
PURPOSE: A substrate transfer device and a substrate processing device including the same are provided to prevent the generation of temperature deflection between substrates by equally establishing temperature hysteresis of each substrate. CONSTITUTION: A heating stage(10) is transferred under an ascended substrate. A robot arm(3) transfers the substrate to a next stage. The heating stage is serially arranged along a traveling direction of the robot arm. An elevating device(13) is ascended and descended and returns the substrate. A timing adjusting device steps forward at the leading end side of the robot arm and steps backward at the back end side of the robot arm.
Description
technical field [0001] The present invention relates to making the temperature histories of the respective substrates the same even when a plurality of substrates are transported at one time by one robot arm, preventing temperature unevenness among the substrates, and enabling uniform completion of the plurality of substrates, Furthermore, a substrate transfer device capable of rapid transfer and a substrate processing device including the substrate transfer device are provided. Background technique [0002] Various proposals have been made in order to prevent unevenness in processing in processing equipment that performs drying processing or heat processing while transferring various substrates. For example, the object of the "resist solution coating processing device" in Patent Document 1 is to provide a resist solution coating processing device that can eliminate contact transfer unevenness and drying unevenness caused by contact between the back surface of the substrate ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/06
CPCG02F1/1303H01L21/67098H01L21/67742H01L21/67745H01L21/68714
Inventor 西尾勤
Owner CHUGAI RO CO LTD