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Packaging structure of integrated magnetic and accelerometer and packaging method thereof

A technology of acceleration sensor and magnetic sensor, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of increasing product cost, wasting PCB board space, reducing product assembly efficiency, etc., and achieving packaging cost , expand the effect of the application

Active Publication Date: 2015-02-04
MEMSIC SEMICON WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The use of multiple single sensors not only greatly reduces the efficiency of product assembly, but also wastes a lot of space on the PCB board, increases product costs, and limits the popularization and promotion of sensor products

Method used

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  • Packaging structure of integrated magnetic and accelerometer and packaging method thereof
  • Packaging structure of integrated magnetic and accelerometer and packaging method thereof
  • Packaging structure of integrated magnetic and accelerometer and packaging method thereof

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no. 1 example 100

[0034] See figure 1 As shown, the present invention relates to a first embodiment 100 of a packaging structure integrating magnetic and acceleration sensors, which includes a first wafer 11 and a second wafer 21 .

[0035] Wherein the first wafer 11 is provided with a driving circuit for driving the acceleration sensor and a magnetic sensor and a structural circuit (not shown) of the acceleration sensor, and a first cavity 12 is also provided on the first wafer 11, and in the first cavity 12 A mechanical structure with an acceleration sensor. In addition, the front side of the first wafer 11 is provided with metal pads 13 outside the first cavity 12 .

[0036] The second wafer 21 is bonded on top of the first wafer 11 . A second cavity 22 for matching with the first cavity 12 is opened thereon, and the width of the second cavity 22 along the surface of the wafer is greater than or equal to the size of the mechanical mechanism of the acceleration sensor.

[0037] Metal wires...

no. 2 example 200

[0038] Further, such as figure 2 As shown, it illustrates the second embodiment 200 of the packaging structure of the integrated magnetic and acceleration sensor involved in the present invention, its structure is similar to that of the first embodiment, and also includes a first wafer 31 and a second wafer 41 . The difference between it and the first embodiment lies in the way in which the metal wire 34 is drawn out from the metal pad (pad) 33, which is to drill a hole on the first wafer 31 and lead out through the through-silicon via (TSV) process. The lead-out of the pad in the first embodiment is realized through a sidewall lead process.

[0039] Further, such as image 3 -6, the present invention also provides a packaging method for manufacturing the packaging structure of the integrated magnetic and acceleration sensor involved in the present invention, which includes the following steps:

[0040] 1. First wafer and second wafer preparation and processing (such as ...

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Abstract

The invention relates to a packaging structure of an integrated magnetic and an accelerometer and a packaging method thereof. The packaging structure comprises a first wafer, a second wafer which is bonded above a right side of the first wafer and a magnetic sensor which is backbonded on a back side of the first wafer. A drive circuit for driving the accelerometer and the magnetic sensor and a structural circuit of the accelerometer are arranged on the first wafer. A first cavity is arranged on the first wafer, and a mechanical structure of the accelerometer is arranged in the first cavity. A second cavity coupled with the first cavity is arranged on the second wafer, and a dimension of the second cavity is larger than or equals to a dimension of the mechanical structure of the accelerometer. According to the invention, the triaxial acceleration transducer and the triaxial magnetic sensor are integrated into one packaging structure, such that a highly integrated six-axis sensor is realized, and the six-axis sensor is benefit for further integration and exploitation of functions of the sensor.

Description

technical field [0001] The invention relates to a sensor packaging structure and method, in particular to a packaging structure and a packaging method for an integrated magnetic and acceleration sensor. Background technique [0002] With the increasing expansion of the functions of consumer electronics, the application of sensors has gradually become popular, and image sensors, acceleration sensors, magnetic sensors, etc. have become standard configurations of some handheld electronic devices. However, these sensors with different functions often appear in handheld electronic devices as independent products, such as two-axis or three-axis acceleration sensors, two-axis or three-axis magnetic sensors, gyroscopes, etc.; Relatively large, such as acceleration sensor product size is 3x3mm. At present, there are few products in the market that integrate two or more sensors into the same package. Even if there are individual integrated products, they are large-scale products of 5...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/28
CPCH01L2224/16225
Inventor 陈东敏刘海东段志伟
Owner MEMSIC SEMICON WUXI
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