Semiconductor processing apparatus provided with structure for processing fluid leakage recovery

Abstract

The invention discloses a semiconductor processing apparatus provided with a structure for processing fluid leakage recovery. The semiconductor processing apparatus comprises a micro chamber which is used for closely accommodating and processing a semiconductor wafer, wherein the micro chamber includes an upper chamber portion which forms an upper working surface and / or an upper peripheral part and a lower chamber portion which forms a lower working surface and / or a lower peripheral part. The upper chamber portion and / or the lower chamber portion can move between an open position and a closed position, wherein the open position is used for loading and / or removing the semiconductor wafer, and the closed position is used for closely accommodating the semiconductor wafer. The lower chamber portion comprises a lower chamber plate and a lower box device, wherein the lower chamber plate forms the lower working surface and / or the lower peripheral part, and the lower box device accommodates the lower chamber plate. The lower box device contains an uncovered chamber which is used for accommodating the lower chamber plate. The lower surface of the uncovered chamber is provided with a diversion groove and an outlet of the diversion groove is located on the lower part or a side opening of the lower box device.

Description

【Technical field】 [0001] The invention relates to the field of surface treatment of semiconductor wafers or similar workpieces, in particular to a device for chemically treating the surface of semiconductor wafers, as well as cleaning, etching and other treatments. 【Background technique】 [0002] Wafers are the carriers used to produce integrated circuits. In actual production, the wafers that need to be prepared have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and processes such as Dry treatment process based on chemical vapor and plasma technology. Among them, the wet processing process is a relatively widely used method in the prior art. The wet processing process usually includes a series of steps of immersing or spraying the wafer with a suitable chemical solution. [0003] The prior art includes a device for ultra-cleaning a waf...

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Problems solved by technology

[0004] However, in actual use, it is found that the above-mentioned device also has the following disadvantages: first, the structure of the upper and lower working surfaces of the microchamber that is driven by two driving devices in the device is relatively complicated. A driving device drives the upper or lower working surface of the microchamber to achieve the same effect; second, for semiconductor wafers of different sizes, it is necessary to replace the corresponding microchamber components of different sizes during processing. It is very inconvenient to disassemble the whole machine when the microchamber is assembled; thirdly, when the microchamber is not tightly sealed or the chemical agent leaks in the pipeline of the chemical agent, the relevant leakage collection mechanism in the device is not perfect ; Fourth, the relative movement of the upper and lower working surfaces relies on a number of metal columns running through the upper and lower working surfaces, and the columns are easily affected by the high temperature and / or Damaged by corrosion by corrosive gases

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