A kind of method for preparing p-n junction of thin film solar cell
A technology of solar cells and thin films, which is applied in the manufacture of circuits, electrical components, and final products. It can solve problems affecting the production cost and service life of thin-film solar cells, affect the adhesion of films, and prolong the production cycle, so as to shorten the production cycle. The effect of rich raw materials and avoiding pollution
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0042] (1) Clean the substrate of transparent conductive glass and dry it with nitrogen;
[0043] (2) Place the cleaned and dried substrate on the substrate stage in the cavity of the plasma chemical vapor deposition system;
[0044] (3) Weigh 4.75g and 12.4g of stannous chloride and sodium thiosulfate respectively, place them in two crucibles, and put them into the raw material evaporation device of the plasma chemical vapor deposition system;
[0045](4) Close the cavity of the plasma chemical vapor deposition system and evacuate to 6×10-3Pa;
[0046] (5) 30 sccm of argon gas is introduced at a pressure of 40 Pa to generate argon plasma;
[0047] (6) Use argon plasma to clean the cavity of the plasma chemical vapor deposition system and the substrate in the cavity. The processing time is 20 minutes, and the power of the argon plasma is 30W;
[0048] (7) Turn on the heating device on the substrate table to heat the substrate at a temperature of 300°C;
[0049] (8) Turn on ...
Embodiment 2
[0055] (1) Clean the substrate as quartz glass and dry it with nitrogen;
[0056] (2) Place the cleaned and dried substrate on the substrate stage in the cavity of the plasma chemical vapor deposition system;
[0057] (3) Weigh 4.75g and 1.6g of stannous chloride and elemental sulfur respectively, place them in two crucibles, and put them into the raw material evaporation device of the plasma chemical vapor deposition system;
[0058] (4) Close the cavity of the plasma chemical vapor deposition system and evacuate to 2×10-4Pa;
[0059] (5) 50 sccm of argon gas is introduced at a pressure of 50 Pa to generate argon plasma;
[0060] (6) Use argon plasma to clean the cavity of the plasma chemical vapor deposition system and the substrate in the cavity. The processing time is 30 minutes, and the power of the argon plasma is 50W;
[0061] (7) Turn on the heating device on the substrate table to heat the substrate at a temperature of 350°C;
[0062] (8) Turn on the raw material e...
Embodiment 3
[0068] (1) Clean the substrate of transparent conductive glass and dry it with nitrogen;
[0069] (2) Place the cleaned and dried substrate on the substrate stage in the cavity of the plasma chemical vapor deposition system;
[0070] (3) Weigh 1.3g and 3.75g of tin tetrachloride and sodium thiosulfate respectively, place them in two crucibles, and put them into the raw material evaporation device of the plasma chemical vapor deposition system;
[0071] (4) Close the cavity of the plasma chemical vapor deposition system, and evacuate to 8×10-3Pa;
[0072] (5) 40 sccm of argon gas is introduced at a pressure of 50 Pa to generate argon plasma;
[0073] (6) Use argon plasma to clean the cavity of the plasma chemical vapor deposition system and the substrate in the cavity. The processing time is 25 minutes, and the power of the argon plasma is 50W;
[0074] (7) Turn on the heating device on the substrate table to heat the substrate at 250°C;
[0075] (8) Turn on the raw material...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More