Pattern contraposition method based on double printing stations and device thereof

A double printing table and alignment device technology, applied in printing, printing presses, rotary printing presses, etc., can solve the problems of silicon wafer grid line pattern offset or misalignment, overcome size and shape errors, ensure high quality, The effect of increasing productivity

Active Publication Date: 2012-10-31
S C NEW ENERGY TECH CORP
View PDF11 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem in the prior art that relying on the edge alignment of the silicon wafer of the solar cell, it is easy to generate deviation accumulation in the secondary printing or mask pattern, resulting in the shift or dislocation of the grid line pattern of the silicon wafer, and proposes to use the silicon wafer The method and device for aligning the preset graphics on the surface. The method and device are based on a patent "A high-efficiency screen printing mechanism (patent application number 201220286904.1)" previously applied by the company. On the basis of this patent Realize graphic alignment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pattern contraposition method based on double printing stations and device thereof
  • Pattern contraposition method based on double printing stations and device thereof
  • Pattern contraposition method based on double printing stations and device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] The present invention discloses a kind of pattern alignment method based on double printing station, refer to Figure 4 , the method includes the following steps: (a) printing three discrete reference points on the first printed substrate, preparing three discrete reference points on the screen used in overprinting; the locations of the fiducial points are on the substrate Discrete separation, in order to improve the alignment accuracy of future overprinting; (b) In the subsequent overprinting, use the left camera to take pictures of the three reference points on the substrate transmitted to the left delivery station, and the obtained The positions of the three marks plus the distance from the left delivery station to the middle printing station are set as the reference coordinate system; since the present invention is based on double printing stations, the middle of the equipment is the printing station, and the right side also has the sending station. When the substra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a pattern contraposition method based on double printing stations and a device thereof. The pattern contraposition method comprises the following steps of: printing three reference points on a printing stock printed for the first time, and preparing three reference points on a silk screen in the overprinting process; in the follow-up overprinting process, collecting the coordinates of the reference points on the printing stock on a left part delivery station or a right part delivery station through a camera, and simultaneously collecting the coordinates of the reference points on the silk screen on a middle printing station; and comparing the deviation of the two coordinates by using a controller, and further controlling U, V and W motors to drive the silk screen to carry out movement adjustment. The pattern contraposition method has the advantages that the contraposition printing is carried out on the printing stock by adopting a pattern contraposition manner, the errors of the size and shape existing in the printing stock are overcome, the error accumulation is avoided, the contraposition accuracy of grid lines on the printing stock is effectively increased, and the high quality of silk screen printing is ensured. According to the pattern contraposition method, the charging is carried out at two sides, sheet delivery and printing are simultaneously finished, and the whole printing cycle period is substantially shortened, thereby increasing the productivity of equipment.

Description

technical field [0001] The invention relates to screen printing equipment, in particular to a method and device for aligning positions using graphics in a screen printing process based on double printing stations. Background technique [0002] In the traditional screen printing machine, the alignment is often performed on the side of the silicon wafer of the solar cell. Because there are deviations in the shape and size of each silicon wafer, repeated overprinting is easy to form deviation accumulation, resulting in the occurrence of screen printed silicon wafer grid lines. Offset or dislocation seriously affects the product quality of this process. Contents of the invention [0003] The present invention aims to solve the problem in the prior art that relying on the alignment of the edge of the solar cell silicon wafer, the error accumulation is likely to occur in the secondary printing or mask pattern, resulting in the shift or dislocation of the grid line pattern of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/14
Inventor 磨建新王奇明张涛
Owner S C NEW ENERGY TECH CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products