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Peeling machine

A technology of peeling machine and rack, applied in the field of wire surface cutting, can solve the problems of hidden product quality, cracks, fractures, and surface defects that cannot be completely eliminated, and achieve the effect of improving quality stability and simple structure design.

Inactive Publication Date: 2012-11-07
大连环新新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing technology, there are defects such as burrs and pits on the surface of raw materials to varying degrees. Simple drawing cannot completely eliminate surface defects, and subsequent processing is likely to cause cracks and fractures, causing hidden dangers to product quality.

Method used

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  • Peeling machine

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Embodiment Construction

[0008] Such as figure 1 As shown, the peeling machine includes a frame 1, a drawing device 2, a rotary chip removal device 3 and a cutting die 4, and a motor 7, a cooling box 8, and a cooling pump 9 are installed in the frame 1, and the frame 1 A drawing device 2, a rotary chip removal device 3, and a cutting mold 4 are installed in sequence above the frame 1, and a wire take-up device 6 is installed on one side of the frame 1, which is used to drive the wire 5 to move, and the motor 7 is connected with the rotary chip remover The chip device 3 is connected, and the entrance of the cutting die 4 is provided with a tapered tip to cut the skin of the wire 5 .

[0009] The wire 5 is first pre-drawn by the drawing device 2 to reduce the diameter fluctuation of the wire 5, and then the wire 5 passes through the cutting die 4, and the rotating chip removal device 3 is placed in front of the cutting die 4, and the chips are cut off and thrown away by the high-speed rotating tool out...

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PUM

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Abstract

The invention discloses a peeling machine, which comprises a machine frame, a drawing device, a rotary scrap removing device and a cutting mold, wherein a motor, a cooling box and a cooling pump are arranged in the machine frame, the drawing device, the rotary scrap removing device and the cutting mold are sequentially arranged above the machine frame, one side of the machine frame is provided with a wire collecting device, the motor is connected with the rotary scrap removing device, and a cone-shaped sharp opening is arranged at an inlet part of the cutting mold. The peeling machine has the advantages that the structure design is simple and reasonable, the outer layers of wires with potential defects can be peeled and removed, the poor quality caused by the surface defects in the subsequent processing of the peeled wires is avoided, and the quality stability is improved.

Description

technical field [0001] The invention relates to the technical field of wire surface cutting, in particular to a peeling machine. Background technique [0002] In the existing technology, there are defects such as burrs and pits on the surface of raw materials to varying degrees. Simple drawing cannot completely eliminate surface defects, and cracks and fractures are likely to be caused in subsequent processing, causing hidden dangers to product quality. Contents of the invention [0003] The object of the present invention is to overcome above-mentioned deficiency, a kind of peeling machine is provided. [0004] The technical solution adopted by the present invention to achieve the above object is: a peeling machine, including a frame, a drawing device, a rotary chip removal device and a cutting die, a motor, a cooling box, and a cooling pump are installed in the frame, and the machine A drawing device, a rotary chip removal device, and a cutting die are installed sequent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P13/02
Inventor 李向辉
Owner 大连环新新材料科技有限公司