Peeling machine
A technology of peeling machine and rack, applied in the field of wire surface cutting, can solve the problems of hidden product quality, cracks, fractures, and surface defects that cannot be completely eliminated, and achieve the effect of improving quality stability and simple structure design.
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[0008] Such as figure 1 As shown, the peeling machine includes a frame 1, a drawing device 2, a rotary chip removal device 3 and a cutting die 4, and a motor 7, a cooling box 8, and a cooling pump 9 are installed in the frame 1, and the frame 1 A drawing device 2, a rotary chip removal device 3, and a cutting mold 4 are installed in sequence above the frame 1, and a wire take-up device 6 is installed on one side of the frame 1, which is used to drive the wire 5 to move, and the motor 7 is connected with the rotary chip remover The chip device 3 is connected, and the entrance of the cutting die 4 is provided with a tapered tip to cut the skin of the wire 5 .
[0009] The wire 5 is first pre-drawn by the drawing device 2 to reduce the diameter fluctuation of the wire 5, and then the wire 5 passes through the cutting die 4, and the rotating chip removal device 3 is placed in front of the cutting die 4, and the chips are cut off and thrown away by the high-speed rotating tool out...
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