Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat-dissipating tape and method for manufacturing same

A production method and tape technology, applied in chemical instruments and methods, adhesives, and other household appliances, can solve problems such as shortened service life and defective products, and achieve effective heat dissipation, excellent thermal conductivity, and excellent heat dissipation effects.

Active Publication Date: 2012-11-14
YOULCHON CHEM
View PDF4 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the emitted heat cannot be removed, it will easily lead to shortened service life or defective products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-dissipating tape and method for manufacturing same
  • Heat-dissipating tape and method for manufacturing same
  • Heat-dissipating tape and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The heat dissipation tape in Example 1 showed a heat dissipation effect of reducing the temperature of the LED strip by 5-7°C. In Comparative Example 1, the temperature of the LED strip was reduced by 2-3°C, and in Comparative Example 2 by 3-4°C. At this time, since the thermal conductivity of the PET substrate and the adhesive is low, the heat dissipation effect will be reduced. Although comparative example 3 has the effect of lowering the temperature by 7~8°C, at this time, because the coating is easy to fall off or the adhesion is not good, the heat dissipation effect cannot be sustained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipating tape of the present invention comprises: a metal mesh base; and a heat-dissipating paint layer, wherein the heat-dissipating paint layer is formed on one side or either side of the metal mesh base. In addition, the heat-dissipating tape of the present invention comprises: a metal mesh base; a heat-dissipating paint layer; and an adhesive layer, wherein the heat dissipating paint layer is formed on one side or either side of the metal mesh base, and the adhesive layer is made of thermally conductive adhesives.; The heat-dissipating tape of the present invention is thin, dissipates heat in a vertical direction with respect to a heat-generating source to thereby achieve improved heat-dissipating effects, and has superior adhesion.

Description

technical field [0001] The present invention relates to a heat dissipation tape and a manufacturing method thereof, and more specifically relates to a heat dissipation tape for dissipating heat from parts or devices of electronic products, parts or devices of automobiles and a manufacturing method thereof. Background technique [0002] Recently, electrical, electronic or automotive components or devices such as televisions, video players, computers, medical equipment, office equipment, communication equipment, etc. have become more and more complex. Although electronic components and the like have become more and more complex, the image of the components themselves has continued to be miniaturized due to the gradual reduction in area and the increase in the number of electronic components to be assembled due to miniaturization and higher performance. Therefore, in order to prevent malfunctions and defects caused by the increase of heat generated by each electronic component,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J7/00C09J9/02B32B15/02H05K7/20C09J7/29
CPCC08K3/04B32B2457/20C09J7/0296B32B7/12C09D5/32B32B15/02C09J2483/00H05K7/20481B32B15/20C09J2205/106C09J2203/318C09J2400/163H05K7/20963C09J2433/00C09J2475/00C09D5/18B32B5/02B32B7/06B32B15/08B32B15/18B32B27/10B32B27/12B32B27/18B32B27/308B32B27/36B32B29/02B32B2307/30B32B2307/302B32B2307/732B32B2457/00C09J7/29C09J2301/41
Inventor 郑在哲姜汉俊李星昊金志姬
Owner YOULCHON CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com