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57results about How to "Excellent thermal conductivity λ" patented technology

Crucible for growing cadmium selenide crystal and growing method of cadmium selenide crystal

The invention discloses a crucible for growing a cadmium selenide crystal and a growing method of the cadmium selenide crystal. The crucible comprises an inner-layer crucible, an outer-layer crucible and a crucible cover, wherein the outer-layer crucible is sheathed outside the inner-layer crucible, the crucible cover is used for covering the outer-layer crucible, and a clearance is left between the outer-layer crucible and the inner-layer crucible; the inner-layer crucible comprises a tapered tip part and a first column body part for growing the cadmium selenide crystal, and the first column body part is arranged above the tapered tip part; the internal contour of the outer-layer crucible is matched with the external contour of the inner-layer crucible, and the external contour of the outer-layer crucible is columnar; the inner-layer crucible is made of graphite or pyrolytic boron nitride, and the outer-layer crucible is made of at least one of molybdenum, tungsten, iridium and platinum, and alloys thereof. The crucible can buffer pressure from the inner-layer crucible, so as to prevent the inner-layer crucible from having cracking and melt leakage phenomena; the crucible can guarantee that the inner-layer crucible and the outer-layer crucible cannot be cracked due to thermal expansion.
Owner:北京雷生强式科技有限责任公司 +1

Directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape

The invention discloses directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape, wherein the single-side adhesive tape comprises a base layer, a first heatconduction layer, a first heat conduction adhesive layer and a first release film layer; the first heat conduction layer, the first heat conduction adhesive layer and the first release film layer aresequentially arranged on the base layer; and the first heat conduction adhesive layer at least comprises a combination of a silica gel adhesive and graphene. According to the invention, a proper quantity of graphene and inorganic heat conduction filling materials are introduced into the silica gel adhesive to form a composite heat conduction system; through high-speed dispersion, the graphene andthe inorganic heat conduction filling materials are uniformly dispersed in a silica gel system; the graphene has extremely superior heat conduction performance, so that the heat conduction performance and heat dissipation uniformity of the heat conduction adhesive layer can be remarkably improved; the use reliability of the directional heat conduction adhesive tape is improved; in addition, the invention further introduces a modified nitrogenated flame retardant into the silica gel-graphene-inorganic heat conduction filling material composite heat conduction system; and the flame retardant performance and use safety of the directional heat conduction adhesive tape are further improved.
Owner:SUZHOU SIDIKE NEW MATERIALS SCI & TECH

Integrated package structure for super power vertical chip

The invention belongs to the technical field of semiconductor lighting devices, and in particular discloses an integrated package structure for a super power vertical chip. In the integrated package structure, a metal foil is used for connecting a negative electrode pad of the super power vertical chip and a base electrode, and a high current steady load and a high heat conducting property of the chip are achieved. A package base comprises a positive electrode conductive plate, a negative electrode conductive plate and an insulating heat conducting layer. Eutectic soldering is adopted between the negative electrode pad of the vertical chip and the metal foil, between the metal foil and the negative electrode conductive plate, and between the positive electrode of the chip and the positive electrode conductive plate. By replacing a gold wire or an aluminum wire connecting the negative electrode of the chip and the negative electrode of the package base with the metal foil, the invention solves the problem of difficulty in high current conduction between the LED chip and the package base, improves the heat dissipating performance of the package, achieves reliable high power density package, and can be used for super power LED ultraviolet, visible and infrared lighting systems.
Owner:FUDAN UNIV +1
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