57results about How to "Excellent thermal conductivity λ" patented technology

A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

A mica tape comprising a mica foil, a glass cloth, and an inorganic filler arranged on the glass cloth, wherein the mica tape is wound a plurality of times about an outer circumferential surface of a conductor portion of an electrical rotating machine coil so as to form an insulating layer for the coil, and the inorganic filler has a Mohs hardness falling within a range of 1 to 7 and exhibits a heat conductivity superior to those of the mica foil and the glass cloth, whereby, the inorganic filler is excellent in the heat conductivity and has a Mohs hardness not lower than that of the glass cloth contained in the mica tape, when used together with the inorganic filler.

The object of this invention is to provide a polyamide resin composition excellent in insulating properties, mechanical properties and dimensional stability. This invention is a resin composition containing 100 parts by weight of a polyamide resin and 0.01 to 50 parts by weight of boron nitride nanotubes. The invention also includes a formed article from the resin composition and processes for the production of the resin composition and the formed article.

The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipating tape of the present invention comprises: a metal mesh base; and a heat-dissipating paint layer, wherein the heat-dissipating paint layer is formed on one side or either side of the metal mesh base. In addition, the heat-dissipating tape of the present invention comprises: a metal mesh base; a heat-dissipating paint layer; and an adhesive layer, wherein the heat dissipating paint layer is formed on one side or either side of the metal mesh base, and the adhesive layer is made of thermally conductive adhesives.; The heat-dissipating tape of the present invention is thin, dissipates heat in a vertical direction with respect to a heat-generating source to thereby achieve improved heat-dissipating effects, and has superior adhesion.

A heat-conductive silicone rubber composite sheet having excellent electrical insulation properties, superior strength and flexibility, excellent interlayer adhesion, and particularly favorable thermal conductivity is provided. The composite sheet includes a laminated structure comprising an inner layer and a pair of outer layers laminated to both surfaces of the inner layer. The inner layer is an electrically insulating synthetic resin film layer having a thermal conductivity of not less than 0.3 W / mK, and the outer layers are silicone rubber layers formed by curing a composition including (a) an organopolysiloxane, (b) a curing agent, (c) a heat-conductive filler, and (d) a silicon compound-based adhesion promoter having at least one group selected from the group consisting of an epoxy group, alkoxy groups, a methyl group, a vinyl group, and a group represented by the formula Si-H.

A highly corrosion resistant and highly formable aluminum-alloy clad material, a method for producing the same, a heat exchanger using the same and a method for producing the same are shown. The present aluminum-alloy clad material has an aluminum alloy core material, an intermediate layer material clad on one surface of the core material and a brazing filler metal clad on the surface of the intermediate layer material that is not on the core material side, wherein a crystal grain size of the intermediate layer material before brazing heating is 60 μm or more, and in a cross section of the core material in a rolling direction before brazing heating, when R1 (μm) represents the crystal grain size in a plate thickness direction, and R2 (μm) represents the crystal grain size in the rolling direction, R1 / R2 is 0.30 or less.

A heat exchanger use high strength aluminum alloy fin material having a high strength and excellent in thermal conductivity, erosion resistance, sag resistance, sacrificial anodization effect, and self corrosion resistance, characterized by containing Si: 0.8 to 1.4 wt %, Fe: 0.15 to 0.7 wt %, Mn: 1.5 to 3.0 wt %, and Zn: 0.5 to 2.5 wt %, limiting the Mg as an impurity to 0.05 wt % or less, and having a balance of ordinary impurities and Al in chemical composition, having a metal structure before brazing of a fibrous crystal grain structure, a tensile strength before brazing of not more than 240 MPa, a tensile strength after brazing of not less than 150 MPa, and a recrystallized grain size after brazing of 500 μm or more.

A thermal conductive sheet contains a plate-like boron nitride particle, wherein the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W / m·K or more. The breakdown voltage of the thermal conductive sheet as measured in conformity with JIS C 2110 (2010) is 10 kV / mm or more.

The present invention relates generally to a metallic alloy composed of Titanium and Tungsten that together form an alloy having a Coefficient of Thermal Expansion (CTE), wherein the content of the respective constituents can be adjusted so that the alloy material can be nearly perfectly matched to that of a commonly used semiconductor and ceramic materials. Moreover, alloys of Titanium-Tungsten have excellent electrical and thermal conductivities making them ideal material choices for many electrical, photonic, thermoelectric, MMIC, NEMS, nanotechnology, power electronics, MEMS, and packaging applications. The present invention describes a method for designing the TiW alloy so as to nearly perfectly match the coefficient of thermal expansion of a large number of different types of commonly used semiconductor and ceramic materials. The present invention also describes a number of useful configurations wherein the TiW material is made as well as how it can be shaped, formed and polished into heat sink, heat spreaders, and electrodes for many applications. The present invention also discloses the direct bonding of a TiW substrate to a semiconductor substrate.

Hardware fastener devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

The invention relates to heat-conducting lubricating grease for a high-speed all-steel angular contact bearing and a preparation method of the lubricating grease; the heat-conducting lubricating grease for the high-speed all-steel angular contact bearing is composed of the following raw materials by weight: 85-95% of barium-base lubricating grease, 3-10% of a heat-conducting agent and 2-5% of antioxidant; according to a technical proposal of the invention, the heat-conducting agents namely nano particles are added based on composite barium-base lubricating grease; so that the heat-conducting lubricating grease has a higher speed coefficient and a preferable heat-conducting performance; the bearing is characterized by low noise, low temperature rising, low vibration and longer service life; in addition, situations that speed coefficient of current domestic lubricating grease is short of an operation demand and the current domestic lubricating grease has poor heat conductivity are solved; an electric main shaft oil supply device is eliminated; noise when the high-speed all-steel angular contact bearing is operated is reduced; and temperature rising and vibration values are reduced.

The invention discloses a crucible for growing a cadmium selenide crystal and a growing method of the cadmium selenide crystal. The crucible comprises an inner-layer crucible, an outer-layer crucible and a crucible cover, wherein the outer-layer crucible is sheathed outside the inner-layer crucible, the crucible cover is used for covering the outer-layer crucible, and a clearance is left between the outer-layer crucible and the inner-layer crucible; the inner-layer crucible comprises a tapered tip part and a first column body part for growing the cadmium selenide crystal, and the first column body part is arranged above the tapered tip part; the internal contour of the outer-layer crucible is matched with the external contour of the inner-layer crucible, and the external contour of the outer-layer crucible is columnar; the inner-layer crucible is made of graphite or pyrolytic boron nitride, and the outer-layer crucible is made of at least one of molybdenum, tungsten, iridium and platinum, and alloys thereof. The crucible can buffer pressure from the inner-layer crucible, so as to prevent the inner-layer crucible from having cracking and melt leakage phenomena; the crucible can guarantee that the inner-layer crucible and the outer-layer crucible cannot be cracked due to thermal expansion.

The invention discloses an aerated concrete block. The aerated concrete block is prepared from, by weight, 40-60 parts of coal ash, 30-40 parts of levigated quartz powder, 20-30 parts of desulfurized gypsum, 10-30 parts of talc powder, 10-20 parts of sepiolite powder, 5-15 parts of activated silicon material, 15-25 parts of lime, 5-10 parts of mica powder, 2-8 parts of lightweight ceramsite, 5-15 parts of quartz sand, 3-8 parts of gypsum, 5-15 parts of asbestos powder, 4-10 parts of glass fibers, 3-10 parts of aluminum powder, 2-6 parts of an air entraining agent, 1-5 parts of a foam stabilizer, 3-8 parts of a foam homogenizing agent and 60-80 parts of deionized water. The aerated concrete block meets requirements on heat insulation, energy saving and high strength, and a preparation method of the aerated concrete block is simple, convenient and suitable for industrial production.

This invention discloses a ceramic-carbon heating pipe having a heating matrix, an electrode lead-out rod is connected with both ends of matrix sleeved with a protection pipe, insulation and heat conduction powder is filled between matrix and protection pipe. Its electric-heat transformation rate reaches as high as 99.6% and is oxidation resistant, not easy to be broken with a long work life to 50000 hours, 1.5 times higher than that of the national standard.

A choke coil according to the invention is configured to include: a coil incorporated with terminals and / or intermediate tap, the coil configured of a metal plate being punched and folded; a magnetic material buried with the coil therein; and a radiator of a material with excellent thermal conductivity disposed on a surface of the magnetic material. A small-sized, low-profile choke coil structurally stable with excellent heat dissipation is to be provided.

The invention relates to graphene absorption-resistant hydraulic oil. The hydraulic oil is prepared from the following raw materials in parts by weight: 90-98 parts of base oil, 0.1-5 parts of antioxidant, 1-5 parts of modified graphene oxide, 0.1-5 parts of an anti-rust agent and 0.001-0.1 part of an antifoaming agent. The graphene abrasion-resistant hydraulic oil can solve the dispersing performance of graphene in base oil, and has high stability and friction-reducing and abrasion-resisting effects greatly superior to those of traditional abrasion-resistant hydraulic oil.

The invention discloses a color steel tile with a graphite coating and a preparation method thereof. The color steel tile comprises a base plate located in a middle layer, and the two sides of the base plate are coated with coatings formed by graphite slurry. The graphite slurry is made of, by weight parts, 50-200 parts of fine flake graphite micro powder, 40-160 parts of cashew-nut oil modified phenolic resin or epoxy resin, 10-50 parts of polyvinyl acetal, 40-160 parts of alcohol, 2-10 parts of coupling agent, 2-10 parts of defoamer, 1-10 parts of plasticizer and 2-10 parts of liquid acrylonitrile butadiene rubber. The service life of the obtained color steel tile with the graphite coating can be greatly prolonged, problems that a conventional resin tile ages easily and is low in strength toughness and not resistant to flame and the like are solved; a problem that a conventional color steel tile is heavy in weight and difficult to install is solved; indoor and outdoor heat exchange rate can also be effectively increased, and a problem of high-temperature poor working environments of conventional color steel tile plants is solved; and a problem that at present, on the market the fine flake graphite is massively accumulated and is low in additional value is solved.

The invention relates to a laser lighting component, in particular to a transmissive blue laser lighting component which is of multilayer structure and which comprises a light scattering layer, a baseplate and a light-emitting layer sequentially from bottom to top; the light scattering layer, the base plate and the light-emitting layer are connected in sintered manner; the light scattering layeris made with a glass material having microporous structure; the glass material with the microporous structure is made by mixing well low-melting-point glass powder and hollow alumina microspheres, adding a volatile material to obtain a slurry, and sintering; the base plate is made with alumina or zinc oxide or quartz with surface coating; one side of the base plate is coated with an antireflectivefilm with enhanced blue light transmission; the other side of the base plate is coated with an antireflective film with enhanced yellow light reflection; the light-emitting layer is made with a glassmaterial containing phosphor; the glassy light-emitting layer is made by mixing well the low-melting-point glass powder and phosphor, adding a volatile material to obtain a slurry, and sintering.

The invention discloses directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape, wherein the single-side adhesive tape comprises a base layer, a first heatconduction layer, a first heat conduction adhesive layer and a first release film layer; the first heat conduction layer, the first heat conduction adhesive layer and the first release film layer aresequentially arranged on the base layer; and the first heat conduction adhesive layer at least comprises a combination of a silica gel adhesive and graphene. According to the invention, a proper quantity of graphene and inorganic heat conduction filling materials are introduced into the silica gel adhesive to form a composite heat conduction system; through high-speed dispersion, the graphene andthe inorganic heat conduction filling materials are uniformly dispersed in a silica gel system; the graphene has extremely superior heat conduction performance, so that the heat conduction performance and heat dissipation uniformity of the heat conduction adhesive layer can be remarkably improved; the use reliability of the directional heat conduction adhesive tape is improved; in addition, the invention further introduces a modified nitrogenated flame retardant into the silica gel-graphene-inorganic heat conduction filling material composite heat conduction system; and the flame retardant performance and use safety of the directional heat conduction adhesive tape are further improved.

In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to millimeter-wave band, and a base thereof is formed of metal and serves as ground, an electrically conductive sheet having excellent thermal conductivity and exhibiting restorability and having a size identical with that of the base of the package is laid on the case at a package-bearing location, the package and sheet are fastened together by two or more screws, and the sheet is mounted on the case while it is pressed by a pressing force of 10 N / cm2 or greater owing to fastening.

The invention relates to the field of preparation of graphene composites and discloses a PET / microcrystalline graphene composite heat-conducting film and a preparation method thereof. Expanded graphite is creatively prepared from microcrystalline graphite used as a raw material through secondary intercalation, a high-quality graphene product is obtained through ultrasonic treatment with a mechanical exfoliation method, and the PET / microcrystalline graphene composite heat-conducting film with high heat conductivity can be prepared in batches through process optimization of the graphene product. The prepared PET / microcrystalline graphene composite heat-conducting film has the graphene coating thickness of 3-9 mu m, the thermal diffusion coefficient of 8-12 cm<2> / S and the heat conductivity coefficient of 1,400-1,700 W / (m*k).

An internal combustion engine includes a cylinder head, a cylinder having an opposed surface opposed to the cylinder head and including a water jacket, which is concave in an axial direction of the cylinder, and apiston provided in the cylinder. An oil ring is provided on the piston on a side that is farthest from the cylinder head. At least a portion between a cylinder inner surface and the water jacket in the cylinder is made of a material having a higher thermal conductivity than that of iron. A bottom wall of the water jacket is positioned in the cylinder axial direction between the opposed surface of the cylinder and a lower end of the oil ring when the piston is disposed at a top dead center position.

The invention discloses a high-thermal-conductivity conductive adhesive and a preparation method thereof. The high-thermal-conductivity conductive adhesive comprises a resin matrix and a conductive filler, and the mass ratio of the resin matrix is 30%-33%; wherein the resin matrix comprises hybrid resin, the hybrid resin (100 parts by weight) comprises 10-13 parts by mass of a curing agent, 0.5-0.7 part by mass of an accelerant, 1-2 parts by mass of a coupling agent and 8-11 parts by mass of a diluent ; the hybrid resin comprises the following components in percentage by mass: 40%-62% of bisphenol F epoxy resin, 15%-32% of acrylic acid epoxy dual-cured resin and 17%-30% of methyl methacrylate; the conductive filler is a mixture of flake silver powder and a silver-graphene compound; test results show that the heat conduction and electric conduction effects of the high-thermal-conductivity conductive adhesive are superior to those of existing products on the market, the use performance of LED products is improved, and the service life of the LED products is prolonged.

The present invention provides an epoxy resin molded article excellent in thermal conductivity and an epoxy composition suitable for forming such an epoxy resin molded article. Namely, the present invention relates to an epoxy composition containing an epoxy monomer having a mesogenic skeleton and a phenolic curing agent having a triphenyl methane structure.

The invention belongs to the technical field of thermally conductive materials, and particularly relates to a silicon rubber-based thermally conductive material and a preparation method thereof. The silicone rubber thermally conductive material disclosed in the invention includes the following components in of parts by weight: 14 to 16 parts of silicone rubber, 31 to 33 parts of a metal filler, 21to 25 parts of a metal compound filler, 26 to 29 parts of carbon fibers, and 0.3 to 0.5 part of a silane coupling agent, wherein the silicone rubber is at least one selected from the group consistingof methyl vinyl silicone rubber, methyl silicone rubber, methyl vinyl phenyl silicone rubber, and fluorosilicone rubber.

A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W / m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

The invention belongs to the technical field of semiconductor lighting devices, and in particular discloses an integrated package structure for a super power vertical chip. In the integrated package structure, a metal foil is used for connecting a negative electrode pad of the super power vertical chip and a base electrode, and a high current steady load and a high heat conducting property of the chip are achieved. A package base comprises a positive electrode conductive plate, a negative electrode conductive plate and an insulating heat conducting layer. Eutectic soldering is adopted between the negative electrode pad of the vertical chip and the metal foil, between the metal foil and the negative electrode conductive plate, and between the positive electrode of the chip and the positive electrode conductive plate. By replacing a gold wire or an aluminum wire connecting the negative electrode of the chip and the negative electrode of the package base with the metal foil, the invention solves the problem of difficulty in high current conduction between the LED chip and the package base, improves the heat dissipating performance of the package, achieves reliable high power density package, and can be used for super power LED ultraviolet, visible and infrared lighting systems.

The invention relates to a substrate for holding at least one component and method for producing the same, the component (4) is specially a power semiconductor, the substrate has a substrate body (1) provided at the front and rear sides with an electrically conductive layer (3, 3a, 3b). For improving the thermal conductivity of the electrically conductive layer (3, 3a, 3b), an electrically insulated connection layer (2, 2a, 2b) is provided between the substrate body (1) and the electrically conductive layer (3, 3a, 3b), which has a duroplastic matrix formed from the pre-ceramic polymer. In the method for producing the substrate, the electrically conductive layer (3, 3a, 3b), in the presence of the pre-ceramic polymer, is connected with the substrate body (1), then the pre-ceramic polymer is transformed into the thermosetting form, thereby the electrically insulated connection layer (2, 2a, 2b) is formed for connecting the electrically conductive layer (3, 3a, 3b) and the substrate body (1).

The composition is a thermally conductive silicone composition containing the following components (A) to (C) and (D). The component (A) is an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm2 / s at 25° C., and is represented by an average composition formula (1)R1aSiO(4-a) / 2  (1)wherein R1 represents a hydrogen atom, a hydroxy group or a monovalent hydrocarbon group, and a satisfies 1.8≤a≤2.2. The component (B) is a silver powder having a tap density of not lower than 3.0 g / cm3, a specific surface area of not larger than 2.0 m2 / g, and an aspect ratio of 2.0 to 150.0. The component (C) is a thermally conductive filler other than the component (B), having an average particle size of 5 to 100 μm and a thermal conductivity of not lower than 10 W / m° C. The component (D) is a platinum-based catalyst, an organic peroxide and / or a catalyst for condensation reaction.