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Thermal conductive sheet, insulating sheet, and heat dissipating member

Inactive Publication Date: 2012-11-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0013]It is an object of the present invention to provide a thermal conductive sheet capable of being obtained with an easy operation and having an excellent thermal conductivity in the thickness and plane directions, and an insulating sheet and a heat dissipating member obtained by using the thermal conductive sheet.
[0020]In the thermal conductive sheet, the insulating sheet, and the heat dissipating member of the present invention, the plate-like or flake-like filler is contained so that the average orientation angle thereof is 29 degrees or more and the maximum orientation angle thereof is 65 degrees or more. Therefore, the thermal conductivity in the thickness and plane directions of the thermal conductive sheet can be ensured.
[0021]Thus, the thermal conductive sheet, the insulating sheet, and the heat dissipating member of the present invention can be used for various applications as a thermal conductive sheet, an insulating sheet, and a heat dissipating member having an excellent thermal conductivity in the thickness and plane directions.

Problems solved by technology

However, there is a disadvantage that to obtain the thermal conductive sheet described in Japanese Unexamined Patent Publication No. 2010-157563, production of the secondary aggregated particles of the boron nitride is required, so that a complicated process such that the boron nitride is temporarily calcined at high temperature and pulverized to be in a slurry state and then is calcined is required.

Method used

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  • Thermal conductive sheet, insulating sheet, and heat dissipating member
  • Thermal conductive sheet, insulating sheet, and heat dissipating member
  • Thermal conductive sheet, insulating sheet, and heat dissipating member

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0128]6.71 g of PT-110 (trade name, plate-like boron nitride particles, average particle size (light scattering method) of 35 to 60 μm, manufactured by Momentive Performance Materials Inc.) was prepared.

[0129]1.2 g of EPPN-501HY (trade name, phenol novolak epoxy resin, solid, epoxy equivalent of 163 to 175 g / eqiv., softening temperature (ring and ball test) of 61° C., manufactured by Nippon Steel Chemical Co., Ltd.) and 0.3 g of YSLV-120TE (trade name, bisphenol epoxy resin, solid, average particle size (analysis of SEM image) of about 100 μm (classified with a sieve after pulverized), epoxy equivalent of 250 g / eqiv., softening temperature (ring and ball test) of 120° C., manufactured by Nippon Steel Chemical Co., Ltd.) were dissolved in 2 g of solvent (acetone). Next, after 0.05 g of imidazole curing catalyst (curing agent) (2P4 MHZ-PW, manufactured by Shikoku Chemicals Corporation) was added thereto, the above-described PT-110 was mixed and then dried at 60° C. for one hour to rem...

example 2

[0133]A thermal conductive sheet was obtained in the same manner as in Example 1, except that 1.2 g of jER1001 (trade name, bisphenol A epoxy resin, solid, epoxy equivalent of 450 to 500 g / eqiv., softening temperature (ring and ball test) of 64° C., manufactured by Mitsubishi Chemical Corporation) was used instead of EPPN-501HY.

example 3

[0134]A thermal conductive sheet was obtained in the same manner as in Example 1, except that 1.2 g of jER1002 (trade name, bisphenol A epoxy resin, solid, epoxy equivalent of 600 to 700 g / eqiv., softening temperature (ring and ball test) of 74° C., manufactured by Mitsubishi Chemical Corporation) was used instead of EPPN-501HY, and 0.5 g of YSLV-80XY (trade name, bisphenol epoxy resin, crystalline epoxy resin, solid, average particle size (analysis of SEM image) of about 100 μm (classified with a sieve after pulverized), epoxy equivalent of 200 g / eqiv., softening temperature (ring and ball test) of 140° C., manufactured by Nippon Steel Chemical Co., Ltd.) was used instead of YSLV-120TE.

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PUM

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Abstract

A thermal conductive sheet contains a resin and a plate-like or flake-like filler. The average orientation angle of the filler is 29 degrees or more and the maximum orientation angle thereof is 65 degrees or more with respect to the plane direction of the thermal conductive sheet.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Japanese Patent Application No. 2011-108583 filed on May 13, 2011, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a thermal conductive sheet, an insulating sheet, and a heat dissipating member, to be specific, to a thermal conductive sheet for use in power electronics technology and the like, an insulating sheet and a heat dissipating member obtained by using the thermal conductive sheet.[0004]2. Description of Related Art[0005]In recent years, power electronics technology which uses semiconductor elements to convert and control electric power is applied in hybrid devices, high-brightness LED devices, and electromagnetic induction heating devices. In power electronics technology, a high current is converted to, for example, heat, and therefore materials that are disp...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/3737H01L2924/0002H01L2924/00
Inventor HIRANO, KEISUKE
Owner NITTO DENKO CORP
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