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Thermal conductive sheet

Inactive Publication Date: 2011-10-27
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]Such a thermal conductive sheet is mounted, for example, on electronic components, and the electronic components are sometimes exposed to high temperature, for example, in soldering such as reflow soldering of the electronic components. Therefore, water absorbency of the thermal conductive sheet is required to be suppressed so as to avoid damages from the heat causing rapid vaporization of the moisture contained in the thermal conductive sheet.
[0018]Therefore, the thermal conductive sheet of the present invention can be applied in various heat dissipation uses as a thermal conductive sheet in which damage when exposed to high temperature can be suppressed, that is excellent in handleability, and excellent in thermal conductivity in a plane direction.

Problems solved by technology

In such a case, the thermal conductive sheet of Japanese Unexamined Patent Publication No. 2008-280496 is disadvantageous in that the major axis direction of the boron nitride powder is perpendicular to (crossing) the plane direction, and therefore the thermal conductivity in the plane direction is insufficient.

Method used

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Examples

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example 1

[0166]The components described below were blended, stirred, and allowed to stand at room temperature (23° C.) for one night, thereby allowing methyl ethyl ketone (dispersion medium for the curing agent) to volatilize and preparing a semi-solid mixture. The details of the components are as follows: 13.42 g of PT-110 (trade name, plate-like boron nitride particles, average particle size (light scattering method) 45 μm, manufactured by Momentive Performance Materials Inc.), 1 g of jER®828 (trade name, bisphenol A epoxy resin, liquid, epoxy equivalent 184 to 194 g / eqiv., softening temperature (ring and ball method) below 25° C., melt viscosity (80° C.) 70 mPa·s, manufactured by Japan Epoxy Resins Co., Ltd.), 2 g of EPPN-501HY (trade name, triphenylmethane epoxy resin, solid, epoxy equivalent 163 to 175 g / eqiv., softening temperature (ring and ball method) 57 to 63° C., manufactured by NIPPON KAYAKU Co., Ltd), and 3 g (solid content 0.15 g) (5 mass % per total amount of epoxy resins of j...

examples 2 to 9 and 11 to 16

[0173]Thermal conductive sheets were obtained in the same manner as in Example 1 in conformity with the mixing formulation and production conditions shown in Table 1 to Table 3.

example 10

[0174]A mixture was prepared by blending and stirring components (boron nitride particles and polyethylene) in accordance with the mixing formulation of Table 2. That is, during the stirring of the components, the mixture was heated to 130° C., and polyethylene was melted.

[0175]Then, the obtained mixture was sandwiched by two silicone-treated releasing films, and then these were hot-pressed with a vacuum hot-press at 120° C. under an atmosphere (vacuum atmosphere) of 10 Pa with a load of 1 ton (4 MPa) for 2 minutes. A pressed sheet having a thickness of 0.3 mm was thus obtained (ref: FIG. 2 (a)).

[0176]Thereafter, the obtained pressed sheet was cut so as to be divided into a plurality of pieces when projected in the thickness direction of the pressed sheet. Divided sheets were thus obtained (ref: FIG. 2 (b)). Next, the divided sheets were laminated in the thickness direction. A laminated sheet was thus obtained (ref: FIG. 2 (c)).

[0177]Then, the obtained laminated sheet was hot-presse...

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Abstract

A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W / m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Japanese Patent Applications No. 2010-018256 filed on Jan. 29, 2010; No. 2010-090908 filed on Apr. 9, 2010; No. 2010-161849 filed on Jul. 16, 2010; and No. 2010-161852 filed on Jul. 16, 2010, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a thermal conductive sheet, to be specific, to a thermal conductive sheet for use in power electronics technology.[0004]2. Description of Related Art[0005]In recent years, power electronics technology which uses semiconductor elements to convert and control electric power is applied in hybrid devices, high-brightness LED devices, and electromagnetic induction heating devices. In power electronics technology, a high current is converted to, for example, heat, and therefore materials that are disposed near the semiconductor element ar...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCC09K5/14B32B37/10B32B2307/302B32B2457/20C08J5/18C08K3/38C08K7/18C08K2003/382
Inventor IZUTANI, SEIJIUCHIYAMA, HISAEFUKUOKA, TAKAHIROHARA, KAZUTAKAHIRANO, HITOTSUGU
Owner NITTO DENKO CORP
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