Thermal conductive sheet

Inactive Publication Date: 2011-10-27
NITTO DENKO CORP
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0017]In the thermal conductive sheet of the present invention, thermal conductivity in a direction (plane direction) perpendicular to the thickness direction is excellent, and furthermore, water absorbency is suppressed.
[0018]Therefore, the thermal conductive sheet

Problems solved by technology

In such a case, the thermal conductive sheet of Japanese Unexamined Patent Publication No. 2008-280496 is disadvantageous in that the major axis direction o

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal conductive sheet
  • Thermal conductive sheet
  • Thermal conductive sheet

Examples

Experimental program
Comparison scheme
Effect test

Example

Example 1

[0166]The components described below were blended, stirred, and allowed to stand at room temperature (23° C.) for one night, thereby allowing methyl ethyl ketone (dispersion medium for the curing agent) to volatilize and preparing a semi-solid mixture. The details of the components are as follows: 13.42 g of PT-110 (trade name, plate-like boron nitride particles, average particle size (light scattering method) 45 μm, manufactured by Momentive Performance Materials Inc.), 1 g of jER®828 (trade name, bisphenol A epoxy resin, liquid, epoxy equivalent 184 to 194 g / eqiv., softening temperature (ring and ball method) below 25° C., melt viscosity (80° C.) 70 mPa·s, manufactured by Japan Epoxy Resins Co., Ltd.), 2 g of EPPN-501HY (trade name, triphenylmethane epoxy resin, solid, epoxy equivalent 163 to 175 g / eqiv., softening temperature (ring and ball method) 57 to 63° C., manufactured by NIPPON KAYAKU Co., Ltd), and 3 g (solid content 0.15 g) (5 mass % per total amount of epoxy re...

Example

Examples 2 to 9 and 11 to 16

[0173]Thermal conductive sheets were obtained in the same manner as in Example 1 in conformity with the mixing formulation and production conditions shown in Table 1 to Table 3.

Example

Example 10

[0174]A mixture was prepared by blending and stirring components (boron nitride particles and polyethylene) in accordance with the mixing formulation of Table 2. That is, during the stirring of the components, the mixture was heated to 130° C., and polyethylene was melted.

[0175]Then, the obtained mixture was sandwiched by two silicone-treated releasing films, and then these were hot-pressed with a vacuum hot-press at 120° C. under an atmosphere (vacuum atmosphere) of 10 Pa with a load of 1 ton (4 MPa) for 2 minutes. A pressed sheet having a thickness of 0.3 mm was thus obtained (ref: FIG. 2 (a)).

[0176]Thereafter, the obtained pressed sheet was cut so as to be divided into a plurality of pieces when projected in the thickness direction of the pressed sheet. Divided sheets were thus obtained (ref: FIG. 2 (b)). Next, the divided sheets were laminated in the thickness direction. A laminated sheet was thus obtained (ref: FIG. 2 (c)).

[0177]Then, the obtained laminated sheet was ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Fractionaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Login to view more

Abstract

A thermal conductive sheet includes a plate-like boron nitride particle. The thermal conductive sheet has a thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet of 4 W/m·K or more, and the 5% weight loss temperature of 250° C. or more. The thermal conductive sheet has a water absorption of 3 vol % or less.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Japanese Patent Applications No. 2010-018256 filed on Jan. 29, 2010; No. 2010-090908 filed on Apr. 9, 2010; No. 2010-161849 filed on Jul. 16, 2010; and No. 2010-161852 filed on Jul. 16, 2010, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a thermal conductive sheet, to be specific, to a thermal conductive sheet for use in power electronics technology.[0004]2. Description of Related Art[0005]In recent years, power electronics technology which uses semiconductor elements to convert and control electric power is applied in hybrid devices, high-brightness LED devices, and electromagnetic induction heating devices. In power electronics technology, a high current is converted to, for example, heat, and therefore materials that are disposed near the semiconductor element ar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): F28F7/00
CPCC09K5/14B32B37/10B32B2307/302B32B2457/20C08J5/18C08K3/38C08K7/18C08K2003/382
Inventor IZUTANI, SEIJIUCHIYAMA, HISAEFUKUOKA, TAKAHIROHARA, KAZUTAKAHIRANO, HITOTSUGU
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap