Heat-conductive silicone rubber composite sheet

A heat-conducting silicone rubber and composite sheet technology, which is applied in the direction of rubber layered products, semiconductor devices, coatings, etc., can solve the problems of reducing the thermal conductivity of composite sheets, and achieve excellent durability, excellent electrical insulation and mechanical strength levels , the effect of excellent thermal conductivity

Inactive Publication Date: 2011-01-26
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in such a thermally conductive silicone rubber composite sheet, the thermal conductivity of a film formed of aromatic polyimide or the like used as an inner layer is significantly smaller than that of a thermally conductive silicone rubber layer used as an outer layer, thereby reducing the thermal conductivity of the thermally conductive silicone rubber composite sheet. Thermal conductivity of the entire composite sheet
[0006] Other conventional examples of thermally conductive silicone rubber composite sheets include those disclosed in Patent Documents 5-7, but none of these composite sheets provide the combination of excellent interlayer bonding and superior thermal conductivity

Method used

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Examples

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preparation example Construction

[0067] [Preparation of thermally conductive composite sheet]

[0068]

[0069] First, using a mixing device such as a kneader, a Banbury mixer, a planetary mixer, or a Shinagawa mixer, if necessary, with heating to a temperature of about 100° C. or higher, the component (a) The organopolysiloxane and the thermally conductive filler of component (c) are kneaded together. In this kneading step, if desired, reinforcing silica such as fumed silica or precipitated silica, silicone oil or silicone wetting agent, or a flame retardant such as platinum, titanium oxide or benzo The triazole is added and mixed, provided that such addition does not affect the thermal conductivity of the outer layer.

[0070] The homogeneous mixture obtained by the kneading step is cooled to room temperature, and then filtered through a filter or the like. Subsequently, predetermined amounts of the adhesion promoter of component (d) and the curing agent of component (b) are added to the mixture, and se...

Embodiment 1

[0078] (a) 100 parts by mass of polydimethylsiloxane with an average degree of polymerization of 8000 whose both ends are capped with dimethylvinylsiloxy groups and (c) 750 parts by mass of polydimethylsiloxane with an average particle size of 4 μm The thermally conductive filler consisting of alumina powder was kneaded for 40 min at room temperature in a Banbury mixer. After filtering through a 100-mesh filter, 100 parts by mass of the mixture of (a)+(c) and (d) 1.0 parts by mass of an adhesion promoter composed of a silicon compound represented by the structural formula shown below:

[0079]

[0080] (b) 1.9 parts by mass of bis(2-methylbenzoyl) peroxide as an organic peroxide, and 0.4 parts by mass of colorant KE-color-R20 (product name, Shin-Etsu Chemical Co., Ltd.) were mixed, and then the resulting mixture was further kneaded using a two-roll mill to obtain a mixture.

[0081] Subsequently, 100 parts by mass of the mixture thus obtained was dissolved in 47 parts by m...

Embodiment 2

[0083] A thermally conductive silicone rubber composite sheet was prepared in the same manner as in Example 1, except that the amount of the silicon compound in component (d) was changed from 1.0 parts by mass to 0.5 parts by mass.

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Abstract

A heat-conductive silicone rubber composite sheet having excellent electrical insulation properties, superior strength and flexibility, excellent interlayer adhesion, and particularly favorable thermal conductivity is provided. The composite sheet includes a laminated structure comprising an inner layer and a pair of outer layers laminated to both surfaces of the inner layer. The inner layer is an electrically insulating synthetic resin film layer having a thermal conductivity of not less than 0.3 W/mK, and the outer layers are silicone rubber layers formed by curing a composition including (a) an organopolysiloxane, (b) a curing agent, (c) a heat-conductive filler, and (d) a silicon compound-based adhesion promoter having at least one group selected from the group consisting of an epoxy group, alkoxy groups, a methyl group, a vinyl group, and a group represented by the formula Si-H.

Description

technical field [0001] The present invention relates to a heat-conducting silicone rubber composite sheet ideal as a heat-dissipating element interposed between a heat-generating electronic component and a heat-dissipating element such as a heat-dissipating fin or the like. The thermally conductive silicone rubber composite sheet exhibits good electrical insulation and thermal conductivity, as well as excellent strength and flexibility. Background technique [0002] Generally, electrically insulating thermally conductive materials are used as heat dissipation elements for heat-generating electronic and electrical components, such as power transistors, MOS transistors, FETs, thyristors, rectifiers, and transformers. Examples of these electrically insulating heat-conductive materials include materials prepared by mixing metal oxide powder such as beryllium oxide, aluminum oxide, aluminum hydroxide, magnesium oxide, or zinc oxide into synthetic rubber such as silicone rubber (s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B25/08B32B25/20C08L83/04C08K13/02C08K5/54C08J7/043
CPCC08J2483/00C08J7/047H01L2924/0002C08J2379/08C08J7/043H01L2924/00
Inventor 远藤晃洋武井博
Owner SHIN ETSU CHEM IND CO LTD
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