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High-thermal-conductivity conductive adhesive and preparation method thereof

A technology of conductive adhesive and high thermal conductivity, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problem of short service life of electronic components, and achieve the effect of improving performance and life

Inactive Publication Date: 2021-01-19
东莞市华卓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the problem that the heat conduction and conduction effects of the existing thermally conductive adhesives on the market need to be improved, resulting in the short service life of electronic components, the present invention provides a high thermally conductive conductive adhesive and a preparation method thereof

Method used

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  • High-thermal-conductivity conductive adhesive and preparation method thereof

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preparation example Construction

[0039] A preparation method of high thermal conductivity conductive adhesive comprises:

[0040] S101. Using natural flake graphite powder as raw material, stir every 50mL of concentrated sulfuric acid with a concentration of 98% in an ice bath until the temperature drops to no higher than 4°C. Add 2g of graphite powder, 1g of sodium nitrate, and 6g of permanganate in turn under stirring. Potassium, keep the temperature at no higher than 4°C and stir for 2 hours, then raise the temperature of the mixture to 35°C and react for 30 minutes, add 200mL of 5% dilute sulfuric acid, keep the temperature at 60°C, stir for 1 hour, then add 10mL of 30% sulfuric acid % hydrogen peroxide, centrifuged and washed with a mixture of 5% dilute sulfuric acid and 30% hydrogen peroxide to obtain graphite oxide, take 1g of graphite oxide and dilute it to 1L with distilled water, 30kHZ ultrasonic treatment for 1 hour and then stand still for 24 hours, take the upper layer Graphene oxide solution;

...

Embodiment 1

[0051] The mass ratio of the resin matrix is ​​30%;

[0052] The resin matrix includes hybrid resin, curing agent, accelerator, coupling agent, and diluent. According to the mass ratio, add 10 parts of curing agent, 0.5 parts of accelerator, 1 part of coupling agent, and 8 parts of diluent for every 100 parts of hybrid resin;

[0053] The hybrid resins include:

[0054] 40% bisphenol F epoxy resin DER354 by mass;

[0055] Acrylic epoxy dual curing resin with a mass ratio of 32%;

[0056] The mass accounts for 28% methyl methacrylate;

[0057] The conductive filler is a mixture of silver powder and a silver-graphene compound, the silver powder is flake silver powder with a particle size of 6 μm, and the mass ratio of the silver powder is 10%;

[0058] Under the above parameters, the measured resistivity of the thermally conductive adhesive is 1.1×10 -4 Ω·cm. At the same time, the thermal conductivity of the thermally conductive adhesive was tested, and the thermal conductiv...

Embodiment 2

[0060] The mass ratio of the resin matrix is ​​31%;

[0061] The resin matrix includes hybrid resin, curing agent, accelerator, coupling agent, and diluent. According to the mass ratio, 11.5 parts of curing agent, 0.55 parts of accelerator, 1.5 parts of coupling agent, and 10 parts of diluent are added for every 100 parts of hybrid resin;

[0062] The hybrid resins include:

[0063] Bisphenol F epoxy resin DER354 with a mass ratio of 55%;

[0064] Acrylic epoxy dual curing resin with a mass ratio of 25%;

[0065] 20% methyl methacrylate by mass;

[0066] The conductive filler is a mixture of silver powder and a silver-graphene compound, the silver powder is flake silver powder with a particle size of 6 μm, and the mass ratio of the silver powder is 11%;

[0067] Under the above parameters, the measured resistivity of the thermally conductive adhesive is 1.0×10 4 Ω·cm. At the same time, the thermal conductivity of the thermally conductive adhesive was tested, and the therma...

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Abstract

The invention discloses a high-thermal-conductivity conductive adhesive and a preparation method thereof. The high-thermal-conductivity conductive adhesive comprises a resin matrix and a conductive filler, and the mass ratio of the resin matrix is 30%-33%; wherein the resin matrix comprises hybrid resin, the hybrid resin (100 parts by weight) comprises 10-13 parts by mass of a curing agent, 0.5-0.7 part by mass of an accelerant, 1-2 parts by mass of a coupling agent and 8-11 parts by mass of a diluent ; the hybrid resin comprises the following components in percentage by mass: 40%-62% of bisphenol F epoxy resin, 15%-32% of acrylic acid epoxy dual-cured resin and 17%-30% of methyl methacrylate; the conductive filler is a mixture of flake silver powder and a silver-graphene compound; test results show that the heat conduction and electric conduction effects of the high-thermal-conductivity conductive adhesive are superior to those of existing products on the market, the use performance of LED products is improved, and the service life of the LED products is prolonged.

Description

technical field [0001] The invention belongs to the field of LEDs, and in particular relates to a highly thermally conductive and electrically conductive adhesive and a preparation method thereof. Background technique [0002] Conductive adhesive is a functional material that can provide both electrical conductivity and adhesive properties. Due to its excellent electrical conductivity, thermal conductivity and shear strength, it is widely used in the electronic field, especially the grounding of mobile phone flexible circuit boards. However, the heat conduction and conduction effects of existing heat conduction and conduction adhesives on the market need to be improved, resulting in short service life of electronic components. Contents of the invention [0003] Aiming at the problem that the heat conduction and conduction effects of existing heat conduction and conduction adhesives on the market need to be improved, resulting in short service life of electronic components,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J163/10C09J11/06
CPCC08K2003/0806C08K2201/001C08L2201/04C08L2203/206C08L2205/02C09J9/02C09J11/06C09J163/00C08L63/10C08K13/04C08K7/00C08K3/08C08K3/042C08K5/544
Inventor 袁运香
Owner 东莞市华卓电子科技有限公司
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