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Directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape

A technology of high thermal conductivity and thermally conductive adhesive, applied in the direction of adhesives, film/sheet release coatings, film/sheet adhesives, etc., can solve problems such as uneven heat dissipation, unreliable use, and insufficient thermal conductivity. Achieve the effects of improving thermal conductivity and heat dissipation uniformity, improving reliability and safety

Active Publication Date: 2019-06-14
SUZHOU SIDIKE NEW MATERIALS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing directional thermally conductive tapes generally use a resin base layer or a metal film layer to coat an adhesive layer. Although the thermal conductivity has been improved, there is still insufficient thermal conductivity in the face of electronic devices that are becoming lighter and thinner and generating heat exponentially. , uneven heat dissipation performance, unreliable use and other problems

Method used

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  • Directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape
  • Directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape
  • Directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Such as figure 1 As shown, an ultra-thin single-sided tape with directional high thermal conductivity includes a base layer 1, and a first heat conduction layer 2, a first heat conduction adhesive layer 3 and a first release film layer 4 sequentially arranged on the base layer;

[0027] Wherein, the first thermally conductive adhesive layer is formed by mixing, coating and baking the following materials in parts by weight: 100 parts of silica gel adhesive, 45 parts of inorganic thermal conductive filler, 12 parts of graphene, 10 parts of curing agent, 3 parts of coupling agent, 5 parts of flame retardant, solvent 180; The curing agent is a polythiol curing agent, the coupling agent is a silane coupling agent, and the solvent is acetone; It includes: 20 parts of aluminum nitride powder, 15 parts of silicon micropowder, 8 parts of zirconium diboride powder, 5 parts of hafnium carbide micropowder, and 16 parts of beryllium oxide ceramic micropowder.

[0028] Wherein, the ...

Embodiment 2

[0032] Such as figure 1 As shown, an ultra-thin single-sided tape with directional high thermal conductivity includes a base layer 1, and a first heat conduction layer 2, a first heat conduction adhesive layer 3 and a first release film layer 4 sequentially arranged on the base layer;

[0033]Wherein, the first thermally conductive adhesive layer is formed by mixing, coating, and baking the following materials in parts by weight: 80 parts of silica gel adhesive, 35 parts of inorganic thermal conductive filler, 8 parts of graphene, 8 parts of curing agent, 1 part of coupling agent, 3 parts of flame retardant, 150 parts of solvent; the curing agent is a polythiol curing agent, the coupling agent is a silane coupling agent, and the solvent is methyl acetate; the inorganic thermally conductive filler It includes by weight: 30 parts of aluminum nitride powder, 25 parts of silicon micropowder, 14 parts of zirconium diboride powder, 3 parts of hafnium carbide micropowder, and 12 part...

Embodiment 3

[0038] like figure 1 As shown, an ultra-thin single-sided tape with directional high thermal conductivity includes a base layer 1, and a first heat conduction layer 2, a first heat conduction adhesive layer 3 and a first release film layer 4 sequentially arranged on the base layer;

[0039] Wherein, the first thermally conductive adhesive layer is formed by mixing, coating, and baking the following materials in parts by weight: 90 parts of silica gel adhesive, 40 parts of inorganic thermal conductive filler, 10 parts of graphene, 9 parts of curing agent, 2 parts of coupling agent, 4 parts of flame retardant, solvent 165; Described curing agent is polythiol curing agent, and described coupling agent is silane coupling agent, and described solvent is ethanol and methyl acetate (volume ratio 1 : 1) mixed solvent; the inorganic thermally conductive filler includes by weight: 25 parts of aluminum nitride powder, 20 parts of silicon micropowder, 11 parts of zirconium diboride powder...

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Abstract

The invention discloses directional high-heat-conductivity ultrathin single-side adhesive tape and double-side adhesive tape, wherein the single-side adhesive tape comprises a base layer, a first heatconduction layer, a first heat conduction adhesive layer and a first release film layer; the first heat conduction layer, the first heat conduction adhesive layer and the first release film layer aresequentially arranged on the base layer; and the first heat conduction adhesive layer at least comprises a combination of a silica gel adhesive and graphene. According to the invention, a proper quantity of graphene and inorganic heat conduction filling materials are introduced into the silica gel adhesive to form a composite heat conduction system; through high-speed dispersion, the graphene andthe inorganic heat conduction filling materials are uniformly dispersed in a silica gel system; the graphene has extremely superior heat conduction performance, so that the heat conduction performance and heat dissipation uniformity of the heat conduction adhesive layer can be remarkably improved; the use reliability of the directional heat conduction adhesive tape is improved; in addition, the invention further introduces a modified nitrogenated flame retardant into the silica gel-graphene-inorganic heat conduction filling material composite heat conduction system; and the flame retardant performance and use safety of the directional heat conduction adhesive tape are further improved.

Description

technical field [0001] The invention relates to the field of heat-conducting adhesive tapes, in particular to an ultra-thin single-sided adhesive tape and a double-sided adhesive tape with directional and high thermal conductivity. Background technique [0002] With the rapid development of the modern electronics industry, electronic products have gradually become lighter and thinner, and the resulting internal heat dissipation of electronic equipment has become more and more important, because high temperatures will reduce the usability and reliability of electronic equipment. Thermally conductive tape is an indispensable product in the electronic equipment industry. It is not only used to fix components on the circuit board, but also can conduct and dissipate a large amount of heat generated inside electronic components in time. Therefore, thermally conductive tape not only needs to be pasted well It also needs to have superior heat resistance and thermal conductivity. ...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/30C09J7/50C09J183/04C09J11/04C09J11/06
Inventor 金闯张庆杰
Owner SUZHOU SIDIKE NEW MATERIALS SCI & TECH
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