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Two-layer flexible substrate and manufacturing method thereof

A technology of flexible substrates and manufacturing methods, applied in the fields of printed circuit manufacturing, circuit substrate materials, and manufacturing printed circuit precursors, etc., to achieve the effects of less defects, excellent adhesion and corrosion resistance

Active Publication Date: 2015-11-25
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0032] The object of the present invention is to solve the above-mentioned problems in the manufacture of a two-layer flexible substrate using a dry plating method, and to provide a solution that does not have needles that occur when a base metal layer is formed on an insulator film by dry plating. The defect of the copper foil film layer and the copper layer caused by holes, the defect of the base metal layer is small, and the two-layer flexible substrate with excellent adhesion, corrosion resistance and water resistance of the insulator film and the base metal layer is especially suitable for Two-layer flexible substrate for fine pattern formation and COF mounting, and its manufacturing method

Method used

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  • Two-layer flexible substrate and manufacturing method thereof
  • Two-layer flexible substrate and manufacturing method thereof
  • Two-layer flexible substrate and manufacturing method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment

[0110] Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to these examples. The measurement of each property was implemented using the means shown below.

[0111] The measurement method of the pinhole is to position the laminate of the base metal layer and the copper thin film layer obtained by the dry plating method by means of penetration, and then measure its size by using an optical microscope, and measure the pinhole with a diameter of 5 μm to 30 μm. The number of pinholes per square meter.

[0112] The evaluation method for the amount of oligomers is to extract the insulating film after plasma treatment with tetrahydrofuran, and then use the size exclusion chromatography (SEC method) of the extract to measure the proportion of oligomers with a molecular weight of 380 to 13,500. The numerical value before the treatment was set to 100%, and was compared as the "amount of oligomer".

[0113] The measuri...

Embodiment 1

[0122] Hereinafter, a case where surface treatment by plasma treatment is performed on an insulating film will be exemplified.

[0123] A polyimide film with a thickness of 38 μm (manufactured by Toray DuPont Co., registered trademark "Kapton150EN") was applied with a DC voltage of 2000V for 50 seconds between the paired discharge electrodes of the plasma electrode under a nitrogen pressure of 1.6Pa. Plasma treatment is performed on the film-forming surface of the base metal layer. Then, the first layer of the base metal layer is formed on the plasma-treated surface of the polyimide, and the first layer of the base metal layer is made by using a 20% by weight Cr-Ni alloy target (manufactured by Sumitomo Metal Mining Co., Ltd. ), a 20% by weight Cr-Ni alloy base metal layer was formed into a film at a film formation speed of 0.7nm / sec by DC sputtering in an Ar environment.

[0124] The layer thickness was measured with a transmission electron microscope (TEM: manufactured by H...

Embodiment 2

[0127] A polyimide film with a thickness of 38 μm (manufactured by Toray DuPont, registered trademark "Kapton150EN") was applied between the paired discharge electrodes of the plasma electrode for 50 seconds under a nitrogen pressure of 2.4Pa. Plasma treatment is performed on the film-forming surface of the metal layer. Then, the first layer of the base metal layer is formed on the plasma-treated surface of the polyimide, and the first layer of the base metal layer is made by using a 20% by weight Cr-Ni alloy target (manufactured by Sumitomo Metal Mining Co., Ltd. ), a 20% by weight Cr-Ni alloy base metal layer was formed into a film at a film formation speed of 0.7nm / sec by DC sputtering in an Ar environment. The layer thickness was measured with a transmission electron microscope (TEM: manufactured by Hitachi, Ltd.) with respect to a part of the film formed under the same conditions, and it was 0.02 μm. On the 20% by weight Ni-Cr film, a second layer is further formed. The ...

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Abstract

Provided is a two-layer flexible substrate, in particular, a two-layer flexible substrate suitable for fine-pattern formation or COF mounting, which not only has no pinholes of a thin copper film layer or a copper layer that are due to pinholes generated when an undercoat metal layer was formed on an insulator film by dry plating, but also has few pinholes of the undercoat metal layer, and which has excellent adhesion between the insulator film and the undercoat metal layer and excellent corrosion resistance and water resistance. Also provided is a process for producing the two-layer flexible substrate. The two-layer flexible substrate is obtained by forming an undercoat metal layer by dry plating on at least one surface of an insulator film without through any adhesive and forming a thin copper film layer and / or a copper layer on the undercoat metal layer by dry plating. The insulator film had undergone a surface treatment, and the insulator film after the surface treatment had an oligomer amount that was up to 70% of the oligomer amount of the insulator film which had not undergone the surface treatment.

Description

【Technical field】 [0001] The present invention relates to a two-layer flexible substrate and its manufacturing method, and more specifically, to forming a base metal layer (hereinafter sometimes referred to as a "seed layer") on an insulator film by dry plating, and then forming In the copper layer, a 2-layer flexible substrate with fewer pinholes and concave defects and its manufacturing method. 【Background technique】 [0002] Today, LCDs, mobile phones, digital cameras, and various electronic instruments are required to be thin, small, and lightweight. The electronic components mounted on them are trending towards miniaturization, and the substrates used to form electronic circuits include: hard boards Shaped "rigid printed wiring board" and "flexible printed wiring board (hereinafter sometimes referred to as "FPC")" that is film-shaped and flexible and can be bent freely. [0003] In particular, FPC can be used in places that require flexibility, such as wiring boards fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38H05K1/03H05K3/14
CPCH05K3/381H05K1/0393H05K3/022H05K1/03H05K3/14H05K3/38
Inventor 西村英一郎浅川吉幸
Owner SUMITOMO METAL MINING CO LTD