Substrate for embedding active elements and embedding method

Abstract

The invention discloses a method for embedding an active element in a substrate. The method comprises the following steps: forming a first inner-layer circuit pattern on a conductive layer of a first bearing plate; connecting the active element to the first inner-layer circuit pattern on the first bearing plate; processing a hole in a corresponding position of the active element on a medium plate, wherein the length and width of the hole are both equal to or greater than those of the active element; sequentially aligning and stacking a second bearing plate, the medium plate with the hole and the first bearing plate with the active element to form an active element embedding module, wherein the active element on the first bearing plate is located in the active element embedding module and placed in the hole on the medium plate; and performing hot-pressing on the active element embedding module to form a substrate with an embedded active element, wherein the hot-pressing temperature is higher than or equal to the glass conversion temperature of the medium plate. The method disclosed by the invention has the advantages of simple technological steps, high productivity, low cost and the like, and enables repair.

Description

technical field [0001] The invention relates to the technical field of packaging in the microelectronics industry, in particular to a substrate for embedding active components and an embedding method. Background technique [0002] With the rapid increase of light, thin, high-performance portable electronic devices, the so-called rear surface mount (post-SMT) technology, which embeds electronic components inside the substrate, has begun to take shape. At present, although passive components such as embedded resistors, inductors, and capacitors are mainly used, in recent years, the ultimate three-dimensional packaging technology that embeds all active components such as chips, together with passive components inside the substrate, is also developing rapidly. middle. The multilayer printed circuit board with embedded active components represented by the Bumpless Build-Up Layer (BBUL) published by Intel Corporation came out, which can be regarded as embedding active components ...

AI Technical Summary

Problems solved by technology

First of all, because a series of embedding processes of active components and related "build-up" connection processing are time-consuming and laborious, it will inevitably lead to low production efficiency and high cost; secondly, due to the use of multiple high-pressure "build-up" The lamination process of connecting embedded active components is easy to cause the rupture of embedded active components; again, in the usual embedded packaging structure, it is difficult to repair faulty active components, so a higher level must be required Good chips with higher performance; finally, thermal stress due to thermal matching, that is, different thermal expansion coefficients, during the process of pressurization and heating between the connected embedded active components and the substrate material interface problem, prone to connection failure at the junction

The method of "last" embedding active components can solve the above-mentioned problems caused by "first" embedding active components and "intermediate" embedding active components. The traditional "last" embedding active components The active components are embedded after the substrate has completed the "build-up" connection. However, the process of this method is too complicated and time-consuming

[0007] In the process of realizing the present invention, the applicant realized that the prior art method of embedding active components in the substrate has the following technical defects: due to the need for a series of embedding processes and related build-up connection steps, its production efficiency is low ,high cost

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