Structure designs and methods for integrated circuit alignment

Abstract

Devices and methods for pattern alignment are disclosed. In one embodiment, a semiconductor device includes a die including an integrated circuit region, an assembly isolation region around the integrated circuit region, and a seal ring region around the assembly isolation region. The device further includes a die alignment mark disposed within the seal ring region or the assembly isolation region.

Description

technical field [0001] The present invention relates to the field of semiconductors, and more particularly, to structural designs and methods for the alignment of integrated circuits. Background technique [0002] The semiconductor integrated circuit (IC) industry has undergone rapid development. Technological advances in IC materials and design have produced generations of ICs, where each generation has smaller dimensions and more complex circuitry than the previous generation. Semiconductor devices are fabricated by patterning a sequence of patterned and unpatterned layers, and features with respect to successively patterned layers are spatially related to each other. During fabrication, each patterned layer must be aligned with the previous patterned layer with precision. Pattern alignment techniques typically provide alignment marks to achieve total exposure area alignment. As technology nodes continue to shrink, it has been realized that such alignment techniques do ...

AI Technical Summary

Problems solved by technology

As technology nodes continue to shrink, it has been realized that this alignment technique does not provide the desired alignment in the region

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