Multilayer board manufacturing method for improving bonding force of hole wall of PTH slot
A manufacturing method and technology of bonding force, which are used in the manufacture of multilayer circuits and the formation of electrical connection of printed components, etc., can solve the problems of peeling, insufficient bonding force between the substrate and the hole copper, etc., so as to increase the bonding force and solve the problem of insufficient bonding force. Effect
Inactive Publication Date: 2012-11-28
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0004] For this reason, the object of the present invention is to provide a kind of multi-layer board manufacturing method that improves the bonding force of PTH slot hole hole wall, is mainly used in solving the multi-layer board whose board thickness is greater than 3.0mm, when carrying out reliability testing, due to the substrate Insufficient bonding force with the copper in the hole, which leads to the problem of peeling off the copper in the PTH slot hole and the substrate after thermal shock
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[0024] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0025] See figure 1 , figure 2 as shown, figure 1 It is a schematic diagram of the structure of the PTH slot on the outer side of the multilayer circuit board of the present invention; figure 2 It is a structural schematic diagram of the inner layer copper strip on the multilayer circuit board of the present invention. When the multilayer circuit board 1 of the present invention is manufactured, the inner layer copper strips 2 are reserved on the outside of all inner layer boards, and the subsequent gong grooves are located at the inner layer copper strips 2, and are perpendicular to the same The inner copper strip 2 on the axis forms the PTH slot 3 .
[0026] The invention provides a multi-layer board manufacturing method for improving the bonding force of the PTH slot...
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Abstract
The invention discloses a multilayer board manufacturing method for improving a bonding force of a hole wall of a PTH (plugging through hole) slot. The method comprises the following steps: A, manufacturing a multilayer circuit board with inner copper bars; B, slotting the side surface of the multilayer circuit board to form a slot, wherein the slot penetrates through the inner copper bars; and C, metallizing the slot. When the multilayer circuit board is manufactured, the inner copper bars corresponding to a slotting position are kept, the slot on the outer side penetrates through all inner copper bars in the same vertical direction, so that in the slot, a substrate and copper material are staggered and laminated; based on the characteristic that the bonding force between copper and copper in a normal state is larger than that between resin and copper, copper and resin in the slot are in tight fit with a copper layer after copper deposition and electroplating, so that the bonding force of the slot wall and the copper layer is greatly enlarged, and the problem that copper is easily separated from the substrate in the inner hole of the slot because the copper bonding force of the PTH slot is not enough is effectively solved.
Description
Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and specifically relates to a multilayer board manufacturing method for improving the bonding force of PTH slot hole walls, which is mainly used to solve the problem of multilayer boards with a board thickness greater than 3.0mm. During the inspection, the copper in the slot hole was peeled off after thermal shock due to insufficient bonding force between the base material and the hole copper. Background technique: [0002] With the rapid development of electronic technology, more and more electronic products need to set metallized slots (PTH slots) on the side wall of the circuit board to realize the electrical connection between various components, and this side wall metallized slot When the circuit board is powered on, it will generate high temperature, which will easily cause thermal shock to the hole copper in the PTH slot. If the bonding force between the hole copp...
Claims
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Inventor 张岩生周毅邓丹朱拓姜翠红
Owner SHENZHEN SUNTAK MULTILAYER PCB