Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device
A technology of thermal curing agent and frame sealing glue, applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve problems such as pollution and reduce picture quality, and achieve the effect of reducing pollution and improving picture quality.
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[0037] The embodiment of the present invention provides a method for preparing a thermal curing agent, such as figure 1 As shown, the preparation method includes:
[0038] S101. Mix 3,5-dimethylaniline with epoxy resin.
[0039] The mixing ratio of 3,5-dimethylaniline and epoxy resin can be based on actual needs in industrial production, and is not limited in the embodiments of the present invention. However, according to the reaction principle that the two are undergoing a compound reaction, it is preferable in the embodiment of the present invention to mix 3,5-dimethylaniline with an epoxy resin in a molar ratio of 2:1 to make the reaction complete. So as not to waste raw materials.
[0040] Wherein, the above-mentioned epoxy resin may be a bisphenol A type epoxy resin with an epoxy value of 0.51.
[0041] S102. Stir the mixed 3,5-dimethylaniline and epoxy resin within a preset temperature range to cause the two to undergo a chemical reaction to generate a thermal curing agent, the...
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