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Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device

A technology of thermal curing agent and frame sealing glue, applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve problems such as pollution and reduce picture quality, and achieve the effect of reducing pollution and improving picture quality.

Inactive Publication Date: 2012-12-19
BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For some liquid crystal display panels, especially in the ODF process of small-sized liquid crystal display panels, after the array substrate and the color filter substrate are boxed, the liquid crystal and the sealing glue contact immediately, and the thermal curing agent in the uncured sealing glue is small. Molecules are easy to penetrate into the liquid crystal and cause pollution, reducing the picture quality

Method used

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  • Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device
  • Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device
  • Heat curing agent and preparation method thereof, frame sealing adhesive, display panel and display device

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preparation example Construction

[0037] The embodiment of the present invention provides a kind of preparation method of thermosetting agent, such as figure 1 Shown, this preparation method comprises:

[0038] S101. Mixing 3,5-dimethylaniline and epoxy resin.

[0039] The mixing ratio of 3,5-dimethylaniline and epoxy resin can be determined according to actual needs in industrial production, and is not limited in the embodiments of the present invention. However, according to the reaction principle of the combination reaction of the two, in the embodiment of the present invention, it is preferred to mix 3,5-dimethylaniline and epoxy resin with a molar ratio of 2:1, so that the two react completely, So that no raw materials are wasted.

[0040] Wherein, the above-mentioned epoxy resin may be a bisphenol A epoxy resin with an epoxy value of 0.51.

[0041] S102. Stir the mixed 3,5-dimethylaniline and epoxy resin within the preset temperature range to make the two undergo a chemical reaction to generate a ther...

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Abstract

The embodiment of the invention provides a heat curing agent and a preparation method of the heat curing agent, a frame sealing adhesive, a display panel and a display device, relating to the field of display technology, aiming at reducing the pollution of the heat curing agent for liquid crystal in the frame sealing adhesive in a box technology, and improving the picture quality of a liquid crystal display (LCD) device. The preparation method of the heat curing agent comprises the steps of: mixing 3, 5-dimethylaniline and epoxy resin; and leading the mixed 3, 5-dimethylaniline and the epoxy resin to be subjected to combination reaction within the preset temperature range to obtain the heat curing agent. The invention is used for manufacturing the display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a thermosetting agent and a preparation method thereof, a frame sealant, a display panel, and a display device. Background technique [0002] At present, the ODF (One Drop Filling, liquid crystal dripping) process is mostly used in the box alignment process of the liquid crystal display panel, which specifically includes: dropping the liquid crystal on the array substrate, coating the frame sealant on the edge of the color filter substrate, and then, the color filter The film substrate and the array substrate are boxed to form a liquid crystal display panel, and the boxed liquid crystal display panel is irradiated with a certain amount of ultraviolet (Ultraviolet, UV) light, and then heated in a heating furnace to complete the curing of the sealing glue. [0003] The above-mentioned frame sealant has two functions: 1. to bond the array substrate and the color film substrate; 2. ...

Claims

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Application Information

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IPC IPC(8): C08G59/64C09J163/00C09J133/12G02F1/1339
Inventor 肖昂朱海波宋省勳
Owner BEIJING BOE OPTOELECTRONCIS TECH CO LTD
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