Printing method of side face of ceramic substrate and printing device

A technology of ceramic substrates and printing methods, applied in printing devices, printing, printing machines, etc., can solve problems such as high cost, poor consistency, and slow speed, and achieve the effects of high alignment accuracy and high production efficiency

Active Publication Date: 2012-12-26
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially for LTCC (low temperature co-fired ceramic) substrates, the processing method determines the difference between the substrate and the substrate. The relative position of the conductor on the substrate and the edge of the substrate is not consistent. Single chip, slow speed, high cost

Method used

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  • Printing method of side face of ceramic substrate and printing device
  • Printing method of side face of ceramic substrate and printing device
  • Printing method of side face of ceramic substrate and printing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] 1. Machining: combined with overlooking figure 1 and section figure 2 , the metal plate 1 is processed into a metal frame with several cavities 2 by machining, and then a step cavity 3 is processed around the cavities 2 on both sides of the metal plate;

[0037] 2. Glue compounding: mix Dow Corning glue and curing powder according to a certain ratio, and stir evenly;

[0038] 3. Pouring: Seal one side of the metal frame with plastic, place it flat on the workbench, pour the prepared glue into the cavity, so that the height of the glue is slightly higher than the height of the frame;

[0039] 4. Curing: combining image 3 , use negative pressure to discharge the gas in the colloid, let it stand for a period of time to cure naturally, remove the colloid higher than the height of the frame after curing, and the flat colloid 4 in the cavity afte...

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PUM

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Abstract

The invention belongs to the technical field of a ceramic package. The invention relates to a printing method of a side face of a ceramic substrate and a printing device. A frock clamp with high position precision in the printing device is provided; the ceramic substrate is placed in the clamp; a conductor pulp is printed on the side face of the ceramic substrate, so that terminal electrodes on the side face of the ceramic substrate are connected to each other. By adopting the method, the productivity is largely improved from one substrate printed every time to more than one hundred of substrates printed every time; so that the speed of side printing a low temperature co-fired ceramic (LTCC) substrate is largely improved, and the method plays an important role in the post-printing technique production of the LTCC substrate.

Description

technical field [0001] The invention belongs to the ceramic packaging technology, and relates to the side electrode interconnection technology of ceramic substrates including LTCC substrates and a novel realization device. Background technique [0002] In recent years, with the development of packaging technology, more and more ceramic substrates need to realize high-precision interconnection of side terminal electrodes on the side. Especially for LTCC (low temperature co-fired ceramic) substrates, the processing method determines the difference between the substrate and the substrate. The relative position of the conductor on the substrate and the edge of the substrate is not consistent. Single chip, slow speed, high cost. Contents of the invention [0003] The purpose of the present invention is to provide a ceramic substrate side connection method and implementation device. [0004] The technical solution to realize the present invention is to design a fixture with hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41M1/12B41M1/34B41F15/08B41F15/14
Inventor 高鹏杨述洪高亮徐姗姗何荣云
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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