Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module

A technology of circuit boards and sub-modules, applied in the direction of circuits, printed circuits connected with non-printed electrical components, electrical components, etc., can solve the problems of restricting the application of large-capacity power electronic commutation systems, difficulty in manufacturing, and low precision

Active Publication Date: 2012-12-26
XIAN YONGDIAN ELECTRIC
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

These shortcomings of IGBT limit its application in large-capacity power electronic converter systems
[0004] In recent years, a small number of IGBT manufacturers have also tried to adopt double-sided heat dissipation pressure contact (press-fit) IGBT packaging, but due to the structural constraints of IGBT multi-chip parallel connection, the control electrode leads between each sub-unit have complex structures, Difficulty in production and low precision

Method used

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  • Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module
  • Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module
  • Circuit board structure and packaging structure for IGBT (insulated gate bipolar transistor) module

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Embodiment Construction

[0021] As described in the background art, in the existing IGBT module packaging technology, how to achieve simple and effective control electrode extraction has always been an unresolved problem. Aiming at this problem, the present invention proposes a circuit board structure in the IGBT module packaging process. Through the circuit board, the control electrodes on each sub-module in the IGBT module can be easily drawn out. Especially in the flat-plate press-fit packaging process, the gate and emitter of each parallel IGBT sub-module can be accurately led to the control terminal through the circuit board structure of the present invention, thereby realizing effective electrical control of the entire IGBT module. .

[0022] The technical solutions of the present invention will be clearly and completely described below through specific embodiments. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments o...

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Abstract

The invention relates to a circuit board structure and packaging structure for an IGBT (insulated gate bipolar transistor) module. The circuit board structure of the IGBT module comprises a trunk, a plurality of electrode pins, an emitter lead wire and a gate lead wire; the electrode pins are arranged on one side of the trunk; the emitter lead wire and the gate lead wire are arranged on one side of the trunk and are parallel to each other. By leading out the gate and the emitting electrode of each IGBT submodule, the purpose of electrically controlling the IGBT module is achieved. Because the circuit board has the characteristics of simple structure and convenience of connection, the control electrodes of all subunits of the IGBT module can be integrated and led out easily, conveniently, accurately and precisely, and the led-out electrodes of the IGBT of the type can be electrically connected.

Description

technical field [0001] The invention relates to the field of IGBT (insulated gate bipolar transistor) devices, in particular to a circuit board structure in an IGBT module packaging process. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor) is internationally recognized as the most representative product of the second revolution in power electronics technology, and is one of the most advantageous power devices in the field of power electronics technology. IGBT is a MOS and bipolar combination device with MOS input and bipolar output functions. Structurally, it is composed of thousands of repeating units (ie, cells), and is a high-power integrated device manufactured by using large-scale integrated circuit technology and power device technology. IGBT is widely used in various fields of the national economy such as motor energy saving, metallurgy, new energy, power transmission and transformation, automotive electronics, rail transit, household appliances...

Claims

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Application Information

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IPC IPC(8): H05K1/18H01L25/07H01L23/498
CPCH01L2924/0002H01L2924/00
Inventor 李先亮张红卫
Owner XIAN YONGDIAN ELECTRIC
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