Testing method of electrotinning uniform plating capacity

A technology of throwing ability and testing method, which is applied in the field of testing the throwing ability of additives, can solve the problems of large difference in current density, large difference in area, rough tin layer and no corrosion resistance, etc., to avoid deviation of results and simple test method , the effect of accurate test results
CN102866079AInactive Publication Date: 2013-01-09XINFENG ZHENGTIANWEI ELECTRONICS TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XINFENG ZHENGTIANWEI ELECTRONICS TECH
Publication Date
2013-01-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a testing method of electrotinning uniform plating capacity. The testing method comprises the following steps of: processing a near cathode and a remote cathode in an electroplating bath by oil removing and micro-etching, and then drying; weighing to obtain the weight m1 of the near cathode and the weight m2 of the remote cathode; connecting the cathode to the positive pole of a rectifier; connecting the near cathode and the remote cathode to the negative pole of the rectifier; turning on a current to start electroplating; then drying the near cathode and the remote cathode after the electroplating; then weighing to obtain the weight m1' of the electroplated near cathode and the weight m2' of the electroplated remote cathode; and calculating the uniform plating capacity. The testing method provided by the invention is simple; two cathode plates are weighed after being carried out same pre-processing and drying during a test, so that the bias of a result due to chemical dissolving of an oxidizing layer can be avoided; and an accurate testing result is achieved.
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Description

technical field

[0001] The invention relates to a method for testing the throwing ability of an additive, in particular to a method for testing the throwing ability of electroplating tin. Background technique

[0002] Graphical copper tin plating is one of the key steps in the PCB manufacturing process. The purpose of its tin plating is to protect the copper layer covered by it from erosion during the etching process. This requires that the tin coating has dense crystallization and good corrosion resistance. However, in the actual electroplating process, due to the large differences in the area of ​​the plated conductors (lines, annular rings, pads, etc.) The layer is rough and not resistant to corrosion. How to quantitatively measure the throwing ability of the additive and the bath with a smaller bath is just the problem to be solved by the present invention. Contents of the invention

[0003] The technical problem solved by the present invention is to provide a metho...

Claims

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