BGA (Ball Grid Array) infrared desoldering machine

Abstract

The invention provides a BGA (Ball Grid Array) infrared desoldering machine comprising a machine body, wherein an upper infrared heating device, a lower infrared heating device, a tool fixture, a controller and a temperature sensor are installed on the machine body, the upper and the lower infrared heating devices are used for heating through infrared, and an optical energy collecting lens is arranged in the upper infrared heating device to perform optical energy collection on the infrared heating. Compared with the hot air type heating manner, the infrared heating device utilizes a non-external force heating manner and has no hot air, thereby generating no chip displacement and avoiding chip collapse short circuit by external force. Meanwhile, the optical energy collecting lens is arranged in the upper infrared heating device to perform optical energy collection on the infrared heating, so that the heat is concentrated. The temperature in the region incapable of being irradiated by the infrared is low so as not to generate bend board or secondary damage on the peripheral parts caused by heating. The heat is concentrated, so that the energy consumption is greatly reduced.

Description

technical field [0001] The invention relates to a desoldering machine, in particular to a BGA infrared desoldering machine used for desoldering BGA chips. Background technique [0002] With the continuous development of IC packaging technology, the size of IC chips continues to shrink, and electronic devices are smaller and thinner. At present, BGA packaging technology in the field of IC packaging has become more popular, and has been widely used in notebook computer motherboards, graphics card motherboards, smartphone motherboards, industrial control computer motherboards, LED TV motherboards, Netcom TVs and other fields. Such as Apple IPHONE mobile phones, tablet computers and other devices. [0003] But for BGA chips, due to its smaller size, the spacing between pins and solder joints is very small. When soldering or desoldering in case of failure, there is great difficulty. The existing desoldering machine is a hot air desoldering technology, such as the utility model...

AI Technical Summary

Problems solved by technology

[0006] 2. When the hot air is heated, the heat is transmitted by the wind, the wind cannot be effectively gathered, and there will be heat energy loss

[0007] 3. For the metal heat sink type display chip, when the hot air is heated, the external force generated by the hot air will cause the chip to sink into a short circuit

[0008] 4. Hot air heating consumes a lot of energy, and the desoldering temperature needs to be 260-270 degrees

[0009] 5. When applied to BGA chip desoldering, the success rate is less than 70%

[0010] Due to the above-mentioned many problems and defects in the hot air desoldering machine, the current BGA chip damage repair and replacement are facing huge problems that cannot be solved.

The use of hot air desoldering not only has a high damage rate of parts and a low success rate, but also consumes a lot of energy and easily causes plate bending

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