Independent multi-cylinder, isobaric and synchronous hydraulic injection molding system for semiconductor plastic packaged mould

Abstract

The invention belongs to the technical field of injection molding of semiconductor moulds and particularly discloses an independent multi-cylinder, isobaric and synchronous hydraulic injection molding system for a semiconductor plastic packaged mould, which is used for reciprocating hydraulic drive of a plurality of injection molding heads in the plastic packaged mould in plastic packaged charging barrels which correspond to the injection molding heads one by one and are in sliding fit with the injection molding heads. The injection molding heads are respectively and correspondingly connected with independent oil cylinders, and all the independent oil cylinders are synchronously driven. The synchronously driven independent oil cylinders corresponding to the injection molding heads are driven respectively, the pressures of the injection molding heads on epoxy plastic packaged materials in the plastic packaged charging barrels are exactly the same, and when the quantities of the epoxy plastic packaged materials in the plastic packaged charging barrels are different, the ideal heights of plastic packaged material cakes are slightly different, at the moment, the injection molding heads form different heights under the action of uniform thrust force and non-uniform resistance force so as to press the epoxy plastic packaged materials into the plastic packaged material cakes, so that the yield of the plastic packaged material cakes is increased, namely the pore defect of plastic packaged parts is reduced, and the pore defect of the plastic packaged parts can be reduced to be less than 0.1%.

Description

technical field [0001] The invention belongs to the technical field of semiconductor mold injection molding, and in particular relates to an independent multi-cylinder, equal pressure and synchronous hydraulic injection molding system for semiconductor plastic sealing molds. Background technique [0002] The rising prosperity of the semiconductor industry promotes the progress of domestic packaging technology. China's semiconductor manufacturing industry is slowly entering a mature stage. The rapid emergence of ultra-high-speed computers, digital audio-visual, mobile communications and portable electronic devices directly drives the progress of chip packaging technology. Chip packaging technology has gone through several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP to MCM, and the packaging form has gradually changed from traditional single-chip packaging to multi-chip packaging. The transformation of the packaging form has led to the continuous improvement of ...

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Problems solved by technology

When used, there is a problem, that is, the injection pressure cannot be exactly the same in theory, for example, if the error is 1.5mm, the selected spring is 50Kg / mm, and the pressure error is 1.5×50=75Kg. Semiconductor parts are prone to loose filling and porosity problems. Moreover, this kind of problem is random and uncertain, and it is difficult to completely solve it in the process. Usually, there are 1% to 1.5% porosity defects, but it is necessary for large-scale production. unacceptable

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