Circuit board soldermask bridge processing method

Abstract

An embodiment of the invention relates to a circuit board soldermask bridge processing method. The method includes the steps: designing and making a shield on a base plate corresponding to a soldermask bridge; transferring a pattern of the base plate with the shield onto a screen printing plate, and performing local ink soldermask on a circuit board through the screen printing plate; subjecting the whole circuit board to ink soldermask; transferring the pattern on the base plate to the circuit board for exposure; and developing the soldermask ink at a welding copper position of the circuit board after exposure to form a soldermask bridge. The circuit board soldermask bridge processing method mainly solves the problems that quality of soldermask bridges processed according to existing soldermask bridge processing methods cannot be guaranteed, and manufacturing cost is high, and cost is saved while quality of the soldermask bridge of the circuit board is guaranteed.

Description

technical field [0001] The embodiment of the present invention relates to a processing method of a circuit board solder resist bridge, in particular to a processing method of a thick copper circuit board solder resist bridge. Background technique [0002] Thick copper circuit boards are mainly used in power modules. Power modules tend to be lighter and thinner. Therefore, the circuit boards used in power modules are required to be denser and the spacing is smaller and smaller. A small solder-resisting bridge, commonly known as a green oil bridge, is used. The so-called solder-resisting bridge refers to the insulating solder-resisting ink between the surface mounts, and its main function is to resist tin during the soldering process. The conventional process of solder masking for existing circuit boards: …→solder mask circuit board→solder mask circuit board again→exposure\development→…, the solder mask ink is printed on the entire circuit board for the two solder masks, and t...

AI Technical Summary

Problems solved by technology

The conventional process of solder masking for existing circuit boards: …→solder mask circuit board→solder mask circuit board again→exposure\developing→…, the solder mask ink is printed on the entire circuit board for the two solder masks, and the solder mask bridge In the place where the solder resist ink is printed twice, the thickness of the solder resist ink is too thick. If the normal exposure energy is used, the exposure cannot irradiate the solder resist ink at the bottom. The solder resist ink at the bottom is not exposed, and it is easy to overdevelop during the development process. , produce the phenomenon of solder resist bridge; if the exposure energy is increased, it is easy to cause the phenomenon of unclean development. Using this method, the quality of the solder resist bridge is difficult to be guaranteed; in addition, the solder resist ink at the position of the solder resist bridge is due to repeated printing Also caused the waste of solder resist ink, the cost is higher

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