A bonding head device for fully automatic wire bonding equipment

Abstract

The invention is a bonding head device used in automatic wire bonding equipment. Including the bonding head base for installing each component, the bonding component for completing the bonding function, the electromagnetic damping component for increasing or controlling the damping of the bonding body to reduce the vibration during bonding, and the wire burner for completing the bonding function. The sparking assembly of the ball, the clamp assembly used for the clamping and wire feeding functions of the lead wire, the bonding assembly is installed at the bottom of the bonding head base, the electromagnetic damping assembly includes an electromagnetic damping plate and an electromagnet, and the electromagnetic damping assembly The electromagnetic damping plate is installed on the bonding assembly, the electromagnet in the electromagnetic damping assembly is fixed on the bonding head base, the ignition assembly is installed on one side of the bonding head base, and moves together with the bonding assembly The wire clip assembly is installed on the bonding assembly. The invention controls the electromagnetic damping component to generate proper damping force when the bonding component stops at the bonding position, suppresses the vibration caused by the rapid stop of the ultrasonic transducer and the bonding component, and improves the quality and speed of wire bonding.

Description

technical field [0001] The invention relates to a bonding head device used in automatic wire bonding equipment, which belongs to the transformation technology of the bonding head device used in automatic wire bonding equipment. Background technique [0002] Wire bonding machine is a special equipment for the internal electrical interconnection process of chips and lead frames in the packaging process of IC components and LED lamps, and is a key equipment in the microelectronics packaging industry. With the rapid development of the microelectronics and LED industries, the packaging quality and packaging production speed of components are becoming more and more important, and the requirements for the operation accuracy and speed of wire bonding machines are getting higher and higher. [0003] The bonding head is the core component of the automatic wire bonding machine, which plays a vital role in the bonding quality and bonding speed. However, with the increase of the speed o...

AI Technical Summary

Problems solved by technology

However, as the speed of the bonding head increases, the vibration of the bonding tool caused by sudden start and stop has a huge impact, affecting the bonding speed and quality

[0004] Chinese Patent Application No. 200510200633.8 discloses a lightweight and high-rigidity XY table and bonding head, Chinese Patent Application No. 200610058852.1 discloses an ultrasonic bonding head and a device using an ultrasonic bonding head, and Chinese Patent Application No. 200610140824.4 A light-weight bonding head assembly is disclosed in Chinese Patent Application No. 200620201098.8, which discloses a bonding head device. Chinese Patent Application No. 200910245181.3 discloses a rotary wire bonding head device. Chinese Patent Application No. 201010243239.3 A kind of bonding head device is disclosed in, and a kind of bonding head device etc. are disclosed in Chinese patent application number 201010243441.4, all do not mention in these patent application documents how to solve how to reduce when the bonding head of high-speed motion suddenly starts and stops vibration

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