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Adhesive composition for semiconductors, adhesive film, and semiconductor device

A technology of adhesives and compositions, applied in the field of adhesive compositions of semiconductors, can solve problems such as increasing void ratio, and achieve the effect of improving production efficiency

Inactive Publication Date: 2013-03-06
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, there is a need to improve production efficiency by reducing the time of semi-curing or removing the semi-cure after chip bonding, but the reduction of the semi-cure time causes a problem that the void ratio increases

Method used

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  • Adhesive composition for semiconductors, adhesive film, and semiconductor device
  • Adhesive composition for semiconductors, adhesive film, and semiconductor device
  • Adhesive composition for semiconductors, adhesive film, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10

[0140] Examples 1-10: Preparation of adhesive composition for semiconductor

[0141] As listed in Table 1, the solvent (I: cyclohexanone) was added to the acrylic resin, epoxy resin, curing agent, curing catalyst, filler and silane coupling agent so that the solid content in the solution was 40 wt%, and then the Mill kneading, thereby preparing an adhesive composition for semiconductors.

experiment example

[0160] Experimental Example: Evaluation of Physical Properties of Adhesive Films Prepared Using Adhesive Compositions in Examples and Comparative Examples

[0161] The physical properties of each of the adhesive films prepared using the adhesive compositions of Examples 1 to 10 and Comparative Examples 1 to 3 were evaluated by the following methods, and the results are provided in Table 5 and Table 6. The heat of cure was measured by differential scanning calorimetry (DSC), and the presence of voids after 1 cycle and molding was determined by ultrasonic tomography (SAT). After the reflow resistance test, cracks were observed with the naked eye and die shear strength was measured.

[0162] (1) Curing calorific value and exothermic peak height: The curing calorific value of the prepared adhesive composition was measured by DSC, the temperature rising rate was 10°C / min, and scanning was performed at 0-350°C.

[0163] The exothermic peak means the peak height of the exothermic pe...

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Abstract

The invention refers to an adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film. Concretely, the invention refers to an adhesive composition used for a semiconductor which has two independent solidification zones for respectively performing low temperature solidification and high temperature solidification, thereby eliminating or reducing half solidification and molded solidification (PMC); and concretely, a hole ratio can be reduced to 15% or less than 15% after first recycling when half solidification is eliminated.

Description

technical field [0001] The present invention relates to an adhesive composition for semiconductors and an adhesive film comprising the composition. More specifically, the present invention relates to an adhesive composition for semiconductors having two discontinuous curing bands so that low-temperature curing and high-temperature curing are performed simultaneously and separately, thereby enabling the removal or reduction of pre-cure and post-cure (PMC) time; specifically, to enable the ratio of voids to be reduced to 15% or less after 1 cycle, wherein voids are generally formed in the case of omitting the semi-curing process. Background technique [0002] High capacity of semiconductor devices can be achieved in mass by circuit integration, in which the number of cells per unit area is increased, or in quantity by packaging, in which chips are stacked one on top of the other. [0003] In packaging technology, a multi-chip package (hereinafter “MCP”) in which several chips...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/00C09J163/00C09J7/00H01L23/29
CPCH01L2224/92247H01L2224/29339H01L2224/83191C09J9/00H01L2224/29387H01L2224/2929H01L2224/29344H01L24/32H01L2224/29386H01L2224/29347H01L24/29H01L2224/32145H01L2924/01029H01L2224/29355H01L2224/29388H01L25/0657H01L2924/01012H01L23/293H01L2224/29298H01L2224/32225C08G59/50C08G59/621C08G59/688C09J163/00H01L2924/181C08L33/00H01L2924/3512H01L2924/00H01L2924/0665H01L2924/00014H01L2924/05432H01L2924/0532H01L2924/05032H01L2924/05042H01L2924/0503C09J7/35C09J201/00C09J2301/304C09J2301/40C09J2301/312C09J2301/408
Inventor 朴白晟宋基态金仁焕
Owner CHEIL IND INC
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