A device and method for testing impact toughness of materials
A technology of impact toughness and punch, which is applied in the field of material impact toughness devices, can solve the problems of bulky size and the inability to adjust the initial impact energy arbitrarily, and achieve the effect of small size, large degree of freedom in energy adjustment range, and simple structure
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specific Embodiment approach 1
[0030] Specific implementation mode one: combine figure 1 and figure 2 Explain, a device for testing the impact toughness of materials in this embodiment, the device includes a base 1, a sample support frame 2, a guide seat 5, a cylinder 6, a spring 7, a punch 8, a rigid support plate 9, and a driving piece 10. Coil 11, rubber pad 12 and top cover 13;
[0031] The lower end of the cylinder 6 is fixedly connected to the upper end surface of the base 1, the guide seat 5 is fixed in the middle of the cylinder 6 (threaded connection is adopted, the guide seat 5 plays a guiding role during the movement of the punch 8), and the rigid support plate 9 Located on the upper end surface of the punch 8 and the two are fixedly connected, the upper end surface of the rigid support plate 9 is fixedly connected with a drive piece 10, and the drive piece 10, the rigid support plate 9 and the punch 8 are slidably fitted with the cylinder 6 (in the cylinder 6 inner up and down movement), the ...
specific Embodiment approach 2
[0034] Specific implementation mode two: combination figure 1 Explain that the coil 11 described in this embodiment is a flat coil, the wire of the coil 11 is a copper wire, the cross section of the copper wire is rectangular, there is a gap between two adjacent copper wires, and a high voltage is used between the copper wires and the copper wires. Insulation cladding separates. The undisclosed technical features in this embodiment are the same as those in the first embodiment.
specific Embodiment approach 3
[0035] Specific implementation mode three: combination figure 1 Note that the driving piece 10 in this embodiment is a copper plate, and the thickness of the copper plate is 5mm˜8mm. The undisclosed technical features in this embodiment are the same as those in the first embodiment.
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Abstract
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