Substrate-free LED lamp and manufacturing method thereof

Abstract

The invention discloses a substrate-free LED (Light-Emitting Diode) lamp and a preparation method thereof. The substrate-free LED lamp comprises a base and a plurality of LED lamp beads arranged on a the base, wherein the base is provided with a metal plating a and a metal plating b; a circuit layer is formed on the metal plating a; a heat conducting layer is formed on the metal plating b; pins of the LED lamp beads are welded on the metal plating a; the LED lamp beads and the metal plating a construct a conducting circuit; and the bottoms of the LED lamp beads are tightly attached to the metal plating b, so that heat of the LED lamp beads is convenient to conduct. The substrate-free LED lamp has the advantages of simple structure and good radiating effect; the preparation method is simple and convenient; and the circuit layer and the heat conducting layer are formed on the base by adopting laser etching and electric chemical plating methods, so that the manufacturing cost is low.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a substrateless LED lamp with no substrate and good heat dissipation effect and a preparation method thereof. Background technique [0002] With the development and maturity of LED technology, the indicators of LED are increasing day by day, and LED lighting products have been more and more applications due to their long life, energy saving and environmental protection. The heat generated by a single LED lamp is relatively concentrated, and the heat generated is relatively large. Solving the problem of heat dissipation is the key. [0003] However, at present, LED lamp beads are mostly welded on aluminum substrate or ceramic substrate, and then the aluminum substrate or ceramic substrate is connected to the support. Therefore, a layer of aluminum substrate or ceramic substrate is separated between the LED lamp beads and the support. . Due to the existence of the aluminum subs...

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Problems solved by technology

Due to the existence of the aluminum substrate or ceramic substrate, the thermal resistance between the LED lamp bead and the support is increased, the heat dissipation effect is reduced, and the service life of the LED lamp bead is greatly shortened.

In addition, at the same time, the cost of aluminum substrates is high, the manufacturing process is complicated, and the electrical insulation performance is poor; the ceramic substrates require high-temperature sintering, the process is complex, expensive, poor mechanical properties and fragile

Therefore, the current LED lamps have complicated structure, high manufacturing cost, complicated manufacturing process and poor heat dissipation effect.

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