Exposure apparatus

Abstract

An exposure apparatus of the present invention contains: a moving stage that includes a laser length measuring device, the laser length measuring device is configured to emit and receive a laser light; an XY[theta] direction moving mechanism configured to move the moving stage within a plane; a Z direction moving mechanism configured to move the moving stage and the XY[theta] direction moving mechanism in a direction perpendicular to the plane; a reflective mirror that is configured to reflect the laser light, the laser length measuring device is configured to measure a distance between the laser length measuring device and the reflection mirror; and a control unit configured to control the XY[theta] direction moving mechanism to move the moving stage based on the distance. Since the mirror, which reflects laser from the laser length measuring device provided on the moving stage of the work stage, is integrally fixed to the structural body, which supports the mask stage for holding a mask, when the work stage is moved in the Z direction (a direction perpendicular to the workpiece face), even if the moving stage is moved in the XY direction (direction parallel to the workpiece face), and in the [theta] direction (a rotation direction with respect to an axis perpendicular to the workpiece face), the reflective mirror does not shift. Therefore, when the work stage is moved in the Z direction, even if a slider is moved in the XY direction or the e direction, it is possible to detect the amount of movement thereof by the laser length measuring device. For this reason, the moving stage is moved so that the detected amount of movement may be canceled, whereby the workpiece can be returned to the original position (a position where the position of the mask and that of the workpiece are aligned).

Description

technical field [0001] The present invention relates to an exposure apparatus, and more specifically, to an exposure apparatus capable of reducing the amount of positional displacement on the table top of a mobile table that occurs when the mobile table is moved in a direction perpendicular to the table top. Background technique [0002] The exposure apparatus is used for pattern formation of wiring etc. in the manufacturing process of a printed circuit board, a liquid crystal panel, etc. (hereinafter also referred to as a workpiece). exist Image 6 A configuration example of the above-mentioned exposure apparatus is shown in . [0003] Image 6 The exposure apparatus shown is a projection exposure apparatus equipped with a projection lens for exposing a workpiece by projecting a pattern of a mask on the projection lens. The apparatus shown in this figure shows a projection exposure apparatus that forms The alignment mark is exposed by aligning the alignment mark (hereinaft...

AI Technical Summary

Problems solved by technology

[0028] (6) In the above, although the alignment of the mask M and the workpiece W is completed, and then shifts to the exposure process, however, exposure cannot be performed in this state

[0035] For this reason, as described above, when the movable stage 32 moves in the direction of the optical axis L of the projection lens 40 (Z holding) by the Z-direction moving mechanism 50, even the movable stage 32 holding the workpiece W due to the above-mentioned straightness (suction operation) stage 33) moves (offset) in the XYθ direction, and it is impossible to detect how far the mobile stage 32 has moved in the XYθ direction

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