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Integrated lead frame for multi-gang pot (MGP) mold

A technology of integrating leads and frames, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of low production efficiency and high production cost, and achieve the effects of improving production efficiency, reducing copper materials, and reducing consumption

Inactive Publication Date: 2013-03-27
TONGLING SANJIA YAMADA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of low production efficiency and high production cost caused by the fact that the existing single-row lead frame can package less products at one time

Method used

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  • Integrated lead frame for multi-gang pot (MGP) mold
  • Integrated lead frame for multi-gang pot (MGP) mold
  • Integrated lead frame for multi-gang pot (MGP) mold

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing, the present invention will be further described.

[0013] Such as figure 2 As shown, the integrated lead frame for the MGP mold includes an outer frame 1, base islands, pins 2, and positioning holes 3. The base islands have several rows, and each row includes several groups of base islands. Each group of base islands includes 1 pair of pins 2, there is a certain distance between each pair of pins, the pins 2 are perpendicular to the width direction of the outer frame so that the base islands form a horizontal arrangement, the base islands have 15 rows, and the 15 rows of base islands are outside The frame 1 is arranged at intervals in the width direction, and each row is provided with 9 groups of basal islands. The length of the outer frame 1 is 280.98±0.1mm, and the width of the outer frame 1 is 82.5±0.05mm.

[0014] Such as figure 1 As shown, the existing single-cylinder mold packaging form needs to use twelve sets of...

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Abstract

The invention discloses an integrated lead frame for an MGP mold. The integrated lead frame comprises an outer frame (1), a plurality of rows of base islands, pins (2) and a positioning hole (3), wherein each of the rows of base islands comprises a plurality of groups of base islands, each of the groups of base islands comprises a pair of pins (2), a certain distance is arranged between each pair of pins, and pins (2) are perpendicular to the width direction of the outer frame, so that base islands are arranged transversely. The lead frame and the packaging mode of the MGP mold are used, a plurality of flow channels are arranged on the MGP mold, the plurality of flow channels can add resin to a plurality of rows simultaneously, and lengths of flow channels are short, so that the consumption of the resin inside flow channels can be reduced; and more copper materials are consumed for one lead frame than before, but more products can be produced than before, so that copper materials consumed for each product can be reduced, the production cost can be reduced, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to a lead frame, in particular to an integrated lead frame for an MGP die. Background technique [0002] TO92 type semiconductor is a widely used electronic component in the market. At present, TO92 type semiconductor adopts the packaging form of single-row lead frame and single cylinder mold. When packaging, the lead frame is placed in the mold, and then preheated The good resin is injected into the mold, and the resin enters the cavity of the mold under the extrusion of the injection head, and the packaging of the lead frame is completed after cooling. Since the lead frame used to package TO92 semiconductors is a single-row lead frame, there are only 25 base islands on each lead frame, and there are 2 pins at both ends of each base island, and each lead frame can only package 50 products , so the production efficiency is low; the existing lead frame is packaged in a single-cylinder mold, and twelve sets of mold boxes are requir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
Inventor 姚亮曹杰杨宇花富春代迎桃钱龙
Owner TONGLING SANJIA YAMADA TECH
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