Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cushion material for hot-press and use of the same

A buffer material and hot press technology, applied in the direction of press, lamination, lamination device, etc., can solve the problems of glue overflow, buffer material overflow, uneven thickness of laminated board, etc., to achieve uniform thickness and reduce glue overflow. Situation, effect of dimensional stability improvement

Active Publication Date: 2013-04-03
TECH ADVANCE IND
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in actual operation, buffer materials with high thermal conductivity will also face the problem of "overflow"
Among them, when the thermal conductivity coefficient of the buffer material is too high, the resin on the laminate material will soften and overflow due to the rapid heat conduction at the initial stage of the hot pressing operation (that is, the low temperature stage, when the resin is still in a semi-cured state), and then Contaminate the surface of the buffer material, causing the problem of "overflow"; what's more, if the overflow is too serious, the thickness of the laminated board produced will be uneven, which will seriously affect the stability of production
[0008] In view of this, the present invention provides a reusable buffer material with low thermal conductivity at low temperature and high thermal conductivity at high temperature, which can solve the glue overflow problem of existing buffer materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cushion material for hot-press and use of the same
  • Cushion material for hot-press and use of the same
  • Cushion material for hot-press and use of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A fiber web made of MPIA fibers is used as a base material, and PPTA fibers are used alone as a fiber material. By means of steps such as opening, blending, lapping, carding, and pre-needle-punching, a pre-needle-punched cushioning sheet is formed. Afterwards, several buffer sheets were laminated, and processed by needle-punching, hot-pressing and singeing with 46,500 needles to form a basis weight of about 1600 grams per square M buffer material 1. The thermal conductivity coefficients of the buffer material 1 at 20°C and 160°C were measured respectively, and the results were 0.0915 W / m·K and 0.2651 W / m·K respectively.

Embodiment 2

[0040] A layer of MPIA fibers with a thickness of about 75 microns is covered on both sides of the buffer material 1 to obtain the buffer material 2 .

Embodiment 3

[0042] The steps of Example 1 were repeated to prepare buffer material 3, except that 90% by weight of PP TA fibers and 10% by weight of MP IA fibers were used as fiber materials.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thermal degradation temperatureaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A cushion material for a hot-press is provided. The cushion material comprises: a substrate; and a fiber material, the thermal conductivity coefficient of which is lower than about 0.15 W / mK at about 20 DEG C. and increases with increasing temperature, for example, the thermal conductivity coefficient may be higher than about 0.20 W / mK at about 160 DEG C., wherein the fiber material is needle-punched on the substrate.

Description

technical field [0001] The invention relates to a buffer material for a hot press and its application, in particular to a buffer material with low thermal conductivity at low temperature and high thermal conductivity at high temperature and its application. Background technique [0002] The laminated board is a composite layer structure formed by a hot pressing process, such as a flexible printed circuit board (Flexible Printed Circuit Board, FPCB), IC carrier board, multilayer wiring board, printed circuit board, copper foil laminated board, high Density interlinked board (High Density Intrerconnection, HDI), etc. Taking a Printed Circuit Board (PCB) as an example, it is formed by bonding several layers of film, insulating layer, adhesive layer and metal layer through a hot pressing process. In the hot pressing process, the control of temperature and pressure is extremely important, which not only directly affects the bonding effect between the layers of the obtained lamin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/02
CPCD04H3/105B32B2037/266B30B15/00D04H1/4342B32B37/10D04H1/46D04H1/4374B32B37/02B30B15/061Y10T442/682
Inventor 黄俊智
Owner TECH ADVANCE IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com