Bonding film and used resin thereof

A technology of film and resin layer, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of adhesive film overflow, circuit board reliability, etc., and achieve the effect of reducing the phenomenon of glue overflow

Active Publication Date: 2012-11-21
ITEQ WUXIELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the thermocompression bonding process, the adhesive film often has glue overflow, and as the size of electronic products becomes smaller and smaller, the glue overflow often affects the reliability of high-density circuit boards

Method used

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  • Bonding film and used resin thereof
  • Bonding film and used resin thereof
  • Bonding film and used resin thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0012] At present, the epoxy resin is used as the main material to make the adhesive film, and the adhesive film is used as the bonding interface of the soft and hard board. In order to reduce the phenomenon of glue overflow, rubber components or rubber-modified epoxy resins are added to the impregnated resin. Among them, the weight ratio of the rubber component or the rubber-modified epoxy resin to the unmodified main epoxy resin must be greater than 0.3, so as to change the fluidity of the unmodified main epoxy resin and reduce the glue overflow phenomenon , but it also causes the thermal stability of the adhesive film made by impregnation with this impregnated resin to deteriorate and the expansion characteristics to change, resulting in the deformation of the soft and hard boards in the thermocompression process of bonding the soft and hard boards.

[0013] In addition, there is often a significant difference in polarity between the solvent properties of the epoxy resin wi...

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PUM

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Abstract

The invention relates to a resin composition which is provided with brominated epoxy resin, carbamate modified copolyester, a hardener and a solvent. The invention also relates to a bonding film which comprises glass fiber cloth and a resin layer, wherein the resin layer is distributed on the glass fiber cloth, and the resin layer is provided with the resin composition.

Description

technical field [0001] The present invention relates to a bonding film and the resin used therein, and in particular to a bonding film laminated with multi-layer substrates and the resin used therein. Background technique [0002] With the advancement of science and technology, and in response to the design, development and application of various electronic products, the required circuit board structure is becoming more and more complex, so there are often multi-layer circuit board superposition designs, such as printer print heads, folding mobile phones, Laptop, etc. Multilayer circuit boards are often formed by stacking circuit boards with different characteristics. [0003] Generally speaking, the substrates used in circuit boards can be divided into flexible substrates (referred to as flexible substrates) and rigid substrates (referred to as rigid substrates). Soft boards are mostly made of polyimide (PI), polyethylene terephthalate (Poly (ethylene Terephthalate), PET)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L67/00C08K5/315C09J163/00H05K1/02
Inventor 简镔刘来度
Owner ITEQ WUXIELECTRONICS TECH
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